Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Lithium Titanate Sputtering Target

ST0454 Lithium Titanate Sputtering Target, Li4Ti5O12

Chemical Formula: Li4Ti5O12
Catalog Number: ST0454
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Titanate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Titanate Sputtering Target Description

Lithium titanate sputtering targets are composed of lithium, titanium, and oxygen. High-purity lithium titanate sputter targets are essential in deposition processes to ensure high-quality films. TFM specializes in producing sputtering targets with purities up to 99.9995%, employing stringent quality assurance processes to guarantee the reliability of their products.

Related products: Lithium Sputtering Target, Titanium Sputtering Target

Lithium

TitaniumOxygen

Lithium Titanate Sputtering Target Specification

Material Type Lithium Titanate
Symbol Li4Ti5O12, LTO
Color/Appearance White Solid
Melting Point 1,533 °C (2,791 °F; 1,806 K)
Density 3.43 g/cm3
Type of Bond Elastomer, Indium
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Lithium Titanate Sputtering Target Application

The lithium titanate sputtering target is used for various applications including thin film deposition, decoration, semiconductors, displays, LEDs, and photovoltaic devices. It is also employed in functional coatings and other optical information storage industries, as well as glass coating for car windows and architectural glass, and in optical communication.

Lithium Titanate Sputtering Target Packaging

Our lithium titanate sputter targets are meticulously handled to prevent any damage during storage and transportation, ensuring that the quality of our products remains intact in their original condition.

Get Contact

TFM offers Lithium Titanate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0454 Lithium Titanate Sputtering Target, Li4Ti5O12”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top