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Lutetium Iron Garnet Sputtering Target, Lu₃Fe₅O₁₂

Lutetium Iron Garnet Sputtering Target (Lu₃Fe₅O₁₂)

Introduction

Lutetium Iron Garnet (Lu₃Fe₅O₁₂, often abbreviated as LuIG) sputtering targets are advanced ceramic materials widely used in the fabrication of magnetic thin films and spintronic devices. Known for their exceptional magnetic and optical characteristics, LuIG targets are indispensable in the study of magneto-optical phenomena and the development of next-generation magnetic insulators.

As a member of the rare-earth iron garnet family, Lutetium Iron Garnet offers low magnetic damping, high resistivity, and excellent crystalline compatibility with substrates such as Gadolinium Gallium Garnet (GGG) and Yttrium Iron Garnet (YIG). These properties make it an ideal material for precision thin film growth via sputtering and pulsed laser deposition.

Detailed Description

TFM’s Lutetium Iron Garnet Sputtering Target is manufactured using high-purity oxides through controlled ceramic processing and vacuum sintering to ensure dense microstructures and uniform composition. The target exhibits excellent phase purity and homogeneity, essential for achieving defect-free LuIG films with superior magnetic and optical uniformity.

Typical manufacturing steps include powder mixing, cold isostatic pressing, sintering at optimized temperatures, and precision surface machining to achieve smoothness and tight dimensional tolerances. Optional bonding to copper or titanium backing plates enhances heat dissipation and target lifetime during sputtering.

The intrinsic magneto-optical response and low Gilbert damping constant of LuIG films derived from these targets make them highly suitable for high-frequency magnetic and spin transport applications.

Applications

  • Spintronics and magnonics research

  • Magneto-optical and microwave devices

  • Magnetic tunnel junctions (MTJs)

  • Non-volatile memory elements

  • Thin film sensors and magnetic recording media

  • Photonic and optical isolator components

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaLu₃Fe₅O₁₂Garnet structure ensures magnetic uniformity
Purity99.9% – 99.99%Higher purity enhances magnetic and optical performance
Density≥ 6.5 g/cm³Ensures consistent sputtering and film density
Diameter1–4 inch (custom sizes available)Compatible with various sputtering systems
Thickness3 – 6 mmAffects sputtering rate and film growth control
BondingCopper or Titanium backingImproves thermal conductivity and target stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Lutetium Iron Garnet (Lu₃Fe₅O₁₂)Very low magnetic damping, high optical transparencySpintronics, optical isolators
Yttrium Iron Garnet (Y₃Fe₅O₁₂)Proven magnetic insulator with broader availabilityMicrowave and optical devices
Gadolinium Iron Garnet (Gd₃Fe₅O₁₂)Stronger magneto-optical effectMagneto-optical sensors and films

FAQ

QuestionAnswer
Can the LuIG target be customized?Yes. Size, purity, and bonding options can be customized according to sputtering system requirements.
What deposition methods are compatible?RF magnetron sputtering, PLD, and e-beam evaporation are commonly used.
How is the target packaged?Vacuum-sealed with soft foam protection, packed in export-grade cartons or wooden crates.
What substrate materials are suitable for LuIG films?Gadolinium Gallium Garnet (GGG), Yttrium Aluminum Garnet (YAG), and Sapphire.
Is a bonding plate necessary?Recommended for targets above 2″ or under high power sputtering conditions to enhance heat transfer.

Packaging

Our Lutetium Iron Garnet Sputtering Targets are carefully vacuum-sealed and externally labeled for traceability and quality control. Protective foam and anti-shock packaging ensure the targets arrive intact and free of contamination during transport and storage.

Conclusion

The Lutetium Iron Garnet (Lu₃Fe₅O₁₂) Sputtering Target from TFM offers a reliable, high-purity source for producing magnetic thin films with exceptional performance in research and advanced device applications. Its precision processing and consistent quality ensure superior results in magneto-optical and spintronic fabrication.

For detailed specifications or a quotation, please contact us at [sales@thinfilmmaterials.com].

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Lu₃Fe₅O₁₂ target 4N5+ Ø3"×3 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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