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Lutetium Oxide Sputtering Target

ST0174 Lutetium Oxide Sputtering Target, Lu2O3

Chemical Formula: Lu2O3
Catalog Number: ST0174
CAS Number: 12032-20-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lutetium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lutetium Oxide Sputtering Target Description

The Lutetium Oxide Sputtering Target from TFM is an oxide sputtering material composed of lutetium (Lu) and oxygen (O).

LutetiumLutetium is a chemical element named after Lutetia, the ancient Roman name for Paris, France. It was first mentioned in 1906 and observed by G. Urbain and C.A. von Welsbach, who also accomplished and announced its isolation. The chemical symbol for lutetium is “Lu,” and its atomic number is 71. Lutetium is located in Period 6, Group 3 of the periodic table, within the d-block. Its relative atomic mass is 174.967(1) Dalton, with the number in brackets indicating the measurement uncertainty. Lutetium is the heaviest and hardest of the rare earth elements and is used in various applications, including catalysts, phosphors in LED light bulbs, and in medical imaging.

Related Product: Lutetium Sputtering Target

OxygenOxygen is a chemical element with the symbol “O,” derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also accomplished and announced its isolation. Oxygen has an atomic number of 8 and is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for life, playing a crucial role in respiration and combustion, and is a major component of water, organic compounds, and the Earth’s atmosphere.

Lutetium Oxide Sputtering Target Specification

Material Type Lutetium Oxide
Symbol Lu2O3
Color/Appearance White
Melting Point (°C) 2490
Density  9.42 g/cm3
Molecular Weight 397.93
Exact Mass 397.866

Lutetium Oxide Sputtering Target Application

The Lutetium Oxide (Lu2O3) Sputtering Target is widely used in various applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also valuable in functional coatings, the optical information storage industry, glass coatings for automotive and architectural purposes, and optical communication systems. The material’s properties make it suitable for use in advanced technology and high-performance applications across these industries.

Packaging

Our Lutetium Oxide (Lu2O3) Sputtering Target is meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring that the products maintain their high quality and integrity upon delivery.

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TFM offers Lutetium Oxide (Lu2O3) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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