Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
lutetium-lu-sputtering-target-removebg-preview

ST0027 Lutetium Sputtering Target, Lu

Chemical Formula: Lu
Catalog Number: ST0027
CAS Number: 7439-94-3
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lutetium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lutetium Sputtering Target Description

Lutetium

The lutetium sputtering target is made from high-purity lutetium metal, identified by the symbol “Lu.” Named after Lutetia, the ancient Roman name for Paris, this element was discovered in 1906 by Georges Urbain and Carl Auer von Welsbach. With an atomic number of 71, lutetium is positioned in Period 6, Group 3 of the periodic table, and belongs to the d-block. Its atomic mass is 174.967 Daltons, with a slight uncertainty as indicated by the value in parentheses. This rare metal is essential in advanced technology applications due to its unique characteristics.

Lutetium Sputtering Target Specification

Material Type Lutetium
Symbol Lu
Color/Appearance Silvery, Metallic
Melting Point 1652 °C
Density 9.840 g/cm3
Thermal Conductivity 0.164 W/cm/K @ 25 °C
Coefficient of Thermal Expansion (r.t.) (poly) 9.9 µm/(m·K)
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Lutetium Sputtering Target Applications

The lutetium sputtering target is used for thin film deposition in applications such as decoration, semiconductors, displays, LEDs, photovoltaic devices, functional coatings, optical information storage, glass coatings (including car and architectural glass), and optical communication.

Lutetium also has the following applications:

– Serving as a catalyst for polymerization and hydrogenation processes, as well as for cracking hydrocarbons
– Being used in detectors for positron emission tomography (PET) to detect cellular activity in the body
– Being utilized in cancer treatment
– Determining the age of meteorites

Lutetium Sputtering Target Packaging

Our Lutetium Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Lutetium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0027 Lutetium Sputtering Target, Lu”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top