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Magnesium Aluminate (Spinel) Substrate

Magnesium Aluminate (Spinel) Substrate (MgAl2O4)

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Magnesium Aluminate Substrate

The Magnesium Aluminate  Substrate (MgAl₂O₄) is a versatile single-crystal material widely utilized in bulk acoustic wave and microwave devices, as well as for fast IC epitaxial substrates. Due to the challenges in maintaining a stable single-phase structure, producing high-quality MgAl₂O₄ crystals requires advanced manufacturing techniques. TFM provides superior Magnesium Aluminate (Spinel) substrates tailored to meet the demands of high-performance applications.

Physical Properties of Magnesium Aluminate (Spinel) Substrate

PropertySpecification
MaterialMgAl₂O₄
StructureCubic
Lattice Constanta = 8.085 Å
Growth MethodCzochralski
Hardness8.0 (Mohs Scale)
ColorWhite and Transparent
Melting Point2130°C
Density3.64 g/cm³
Phase Velocity6500 m/s at (100) shear wave
Propagation Loss6.5 dB/ms
Thermal Expansion7.45 × 10⁻⁶/°C

Available Specifications of Magnesium Aluminate (Spinel) Substrate

TFM offers Magnesium Aluminate (Spinel) substrates in various sizes and configurations to meet specific customer requirements.

  • Sizes: 10 × 5 mm, 10 × 10 mm, 20 × 20 mm, Dia 2”
  • Thickness Options: 0.5 mm, 1.0 mm
  • Surface Finish: SSP (Single-Side Polished) or DSP (Double-Side Polished)
  • Crystal Orientations: <100>, <110>, <111>
  • Redirection Precision: ±0.5°
  • Edge Redirection: 2° (customizable to 1°)
  • Surface Roughness (Ra): ≤ 5Å (measured over 5µm × 5µm area)
  • Special Customization: Available for unique size and orientation requirements

Packaging Information

To ensure the integrity and cleanliness of the substrates, TFM packages Magnesium Aluminate (Spinel) substrates in Class 100 clean bags or wafer containers within a Class 1000 cleanroom environment.

Choose TFM for premium-quality Magnesium Aluminate (Spinel) substrates that meet the stringent demands of advanced technological applications.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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