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Magnesium Oxide Sputtering Target

ST0175 Magnesium Oxide Sputtering Target, MgO

Chemical Formula: MgO
Catalog Number: ST0175
CAS Number: 1309-48-4
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Magnesium Oxide (MgO)  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Magnesium Oxide Sputtering Target Description

Our Magnesium Oxide (MgO) Sputtering Target is a high-quality oxide sputtering material, precisely composed of magnesium and oxygen. It is widely used in various applications, including thin film deposition, electronics and semiconductors, optical coatings, and magnetic storage media. These targets are produced by casting pure magnesium and oxygen in a vacuum environment, creating a dense and uniform material with excellent mechanical properties and chemical stability. This manufacturing process ensures high performance and reliability in demanding applications.

Related Product: Magnesium Sputtering Target

Magnesium Oxide Sputtering Target Specification

Material TypeMagnesium Oxide
SymbolMgO
Color/AppearanceWhite, Crystalline Solid
Melting Point2,852 °C
Density3.58 g/cm³
SputterRF
Type of BondIndium bonding
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Magnesium Oxide Sputtering Target Handling Notes

  • Indium Bonding: Indium bonding is recommended for the Magnesium Oxide (MgO) sputtering target. TFM collaborates with the Taiwan Bonding Company to provide high-quality bonding services, ensuring optimal performance and durability of the targets. Standard backing plates are machined to fit the sputtering targets precisely.
  • Thermal Conductivity: Magnesium oxide has low thermal conductivity and is susceptible to thermal shock. Proper bonding and handling techniques are essential to prevent damage and maintain the integrity of the target during the sputtering process.

Packaging

Our Magnesium Oxide (MgO) Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take great care to prevent any damage during storage and transportation, preserving the integrity and quality of the targets for optimal performance in their intended applications.

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TFM offers Magnesium Oxide (MgO) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
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MgO Target 4N ø50.8*2.0mm Indium Bonded to 1.0mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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