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VD0821 Magnesium Sulfide Evaporation Materials, MgS

Catalog No.VD0821
MaterialMagnesium Sulfide (MgS)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Magnesium sulfide (MgS) evaporation material, provided by TFM, is a key sulfide ceramic used in various evaporation processes. Featuring the chemical formula MgS, this material is integral for producing high-quality thin films through deposition techniques. TFM’s magnesium sulfide evaporation materials are crafted to meet rigorous purity standards, ensuring reliable performance in your applications.

MSDS File

Magnesium Sulfide Evaporation Materials Overview

Magnesium sulfide (MgS) evaporation materials from TFM are essential sulfide ceramic materials utilized in advanced deposition processes. With the chemical formula MgS, these high-purity materials are crucial for producing high-quality thin films. TFM is renowned for its capability to manufacture magnesium sulfide evaporation materials with purities reaching up to 99.9995%, supported by comprehensive quality assurance protocols to ensure exceptional product reliability.

Product Specifications

Material TypeMagnesium sulfide
SymbolMgS
Appearance/ColorWhite to reddish brown solid
Melting Point2,000 °C (3,630 °F; 2,270 K) approx.
Density2.84 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Magnesium sulfide evaporation materials are utilized in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are predominantly used for optics applications such as:

  • Wear Protection
  • Decorative Coatings
  • Displays

Packaging and Handling

Our magnesium sulfide materials are meticulously packaged with clear labeling to ensure proper identification and quality control. We take extensive measures to protect the materials from damage during storage and transportation.

Contact Us

TFM is a leading manufacturer and supplier of high-purity magnesium sulfide evaporation materials, available in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities can be arranged upon request. Additionally, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and more information on our products, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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