Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
mgs-removebg-preview-1

ST0282 Magnesium Sulfide Sputtering Target, MgS

Chemical Formula: MgS
Catalog Number: ST0282
CAS Number: 12032-36-9
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Magnesium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Magnesium Sulfide Sputtering Target Description

A magnesium sulfide sputtering target is a type of sulfide ceramic sputtering material composed of magnesium and sulfur, typically represented by the chemical formula MgS. This material is used in various applications, including thin film deposition, due to its unique properties.

MagnesiumMagnesium is a chemical element that originates from the name Magnesia, a district in Eastern Thessaly, Greece. It was first mentioned in 1755 and observed by Joseph Black. The element was later isolated and its discovery announced by Humphry Davy. The chemical symbol for magnesium is “Mg.” It has an atomic number of 12, placing it in Period 3 and Group 2 of the periodic table, within the s-block. The relative atomic mass of magnesium is 24.3050(6) Dalton, with the number in parentheses indicating the uncertainty.

Related Product: Magnesium Sputtering Target

SulfurSulfur, also spelled sulphur, is a chemical element with a history tracing back to ancient civilizations. Its name originates from either the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to sulfur. Sulfur was known and used by Chinese and Indians before 2000 BC. The chemical symbol for sulfur is “S,” and it has an atomic number of 16. In the periodic table, sulfur is located in Period 3 and Group 16, within the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, with the number in parentheses indicating the measurement uncertainty.

Magnesium Sulfide Sputtering Target Specification

Compound FormulaMgS
AppearanceSolid
Melting Point>2000 °C
Density2.68 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Magnesium Sulfide Sputtering Target Application

The magnesium sulfide sputtering target is utilized in various applications, including thin film deposition for semiconductors, displays, LEDs, and photovoltaic devices. It is also employed in decorative coatings and functional coatings for optical information storage, as well as in the glass coating industry, which includes coatings for car glass and architectural glass. Additionally, it finds uses in optical communication technologies.

Magnesium Sulfide Sputtering Target Packing

Our magnesium sulfide sputtering targets are meticulously tagged and labeled externally to ensure easy identification and maintain stringent quality control. We take extensive precautions during storage and transportation to prevent any potential damage, thereby preserving the product’s integrity and quality.

Get Contact

TFM offers Magnesium Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0282 Magnesium Sulfide Sputtering Target, MgS”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top