Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
fluoride-targets-removebg-preview-2

ST0247 Manganese Fluoride Sputtering Target, MnF2

Chemical Formula: MnF2
Catalog Number: ST0247
CAS Number: 7782-64-1
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Manganese Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Manganese Fluoride Sputtering Target Description

The Manganese Fluoride Sputtering Target consists of a fluoride ceramic material made up of manganese and fluorine. This target is specifically designed for use in various sputtering deposition processes.

manganeseManganese, symbolized as “Mn,” is a chemical element that may derive its name from the Latin ‘magnes’, meaning magnet, or from ‘magnesia nigra’, the black magnesium oxide. It was first documented in 1770 by O. Bergman, with its isolation later accomplished by G. Gahn. Manganese occupies the 25th position on the periodic table, located in Period 4 and Group 7 within the d-block. It has a relative atomic mass of 54.938045(5) Dalton, with the figures in parentheses representing the uncertainty of this value.

Related Product: Manganese Sputtering Target

Fluorine

Fluorine, also called fluorin, is a chemical element originated from the Latin ‘fluere’, meaning to flow. It was first mentioned in 1810 and observed by A.-M. Ampère. The isolation was later accomplished and announced by H. Moissan. “F” is the canonical chemical symbol of fluorine. Its atomic number in the periodic table of elements is 9 with location at Period 2 and Group 17, belonging to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, the number in the brackets indicating the uncertainty.

Manganese Fluoride Sputtering Target Application

The Manganese Fluoride Sputtering Target is widely utilized in numerous industrial applications. It is essential for thin film deposition, various decorative processes, and the production of semiconductors, displays, LEDs, and photovoltaic devices. Additionally, it is used in functional coatings relevant to the optical information storage industry. The target also finds applications in the glass coating industry, including coatings for automotive and architectural glass, as well as in optical communication technologies.

Manganese Fluoride Sputtering Target Packing

Our Manganese Fluoride Sputter Targets are clearly marked and labeled on the exterior to ensure efficient identification and rigorous quality control. We take extensive precautions to prevent any potential damage during storage or transportation, ensuring the targets remain in optimal condition.

Get Contact

TFM offers Manganese Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0247 Manganese Fluoride Sputtering Target, MnF2”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top