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VD0715 Manganese(II) Oxide Evaporation Materials, MnO

Catalog No.VD0715
MaterialManganese Oxide (MnO)
Purity99.9%
ShapePowder/ Pellets/ Granule/ Custom-made
At Thin-Film Mat Engineering (TFM), we pride ourselves on being a premier provider of high-purity manganese(II) oxide for evaporation applications, alongside a diverse range of other evaporation materials. Our products come in both powder and granule forms to suit different needs, and we also offer custom solutions tailored to specific requirements. Whether you’re looking for standard or specialized materials, TFM delivers exceptional quality and flexibility to meet your precise specifications.
MSDS File

Manganese(II) Oxide Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity manganese(II) oxide evaporation materials, characterized by the chemical formula MnO. Our manganese(II) oxide is essential for achieving superior quality in deposited films through advanced deposition processes. With purities reaching up to 99.9995%, our materials undergo rigorous quality assurance to ensure exceptional reliability.

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Specifications for Manganese(II) Oxide Evaporation Materials

Material TypeManganese(II) oxide
SymbolMnO
Color/AppearanceGreen Solid
Melting Point1,945 °C
Theoretical Density 5.43 g/cm3
Purity99.9%
ShapePowder/ Pellets/ Granule/ Custom-made

Applications

Manganese(II) oxide evaporation materials are used in various applications, including:

  • Deposition processes such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD)
  • Optics applications, including wear protection, decorative coatings, and display technologies

Packaging and Handling

Our manganese(II) oxide evaporation materials are carefully packaged with clear labeling for easy identification and quality control. We ensure that all materials are protected from damage during storage and transport.

Contact Us

TFM is a leading provider of high-purity manganese(II) oxide evaporation materials, available in various shapes like tablets, granules, rods, and wires. Custom shapes and quantities can be requested. Additionally, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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