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ST0995 Manganese Platinum Sputtering Target, MnPt

Chemical FormulaMnPt
Catalog No.ST0995
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

With our deep expertise in materials science, TFM proudly offers Manganese Platinum Sputtering Targets known for their exceptional purity. Our commitment is evident in providing cost-effective solutions and tailored offerings that meet the most demanding requirements in nanotechnology and thin-film deposition.

MSDS File

Manganese Platinum Sputtering Target Description

Manganese Platinum Sputtering Targets are high-purity materials designed for thin-film deposition processes. They feature excellent thermal stability, outstanding electrical conductivity, and superior corrosion resistance. These targets are well-suited for semiconductor manufacturing, optical coatings, and magnetic storage devices. With precise composition control, they ensure uniform film deposition, enhancing device performance. Manganese Platinum Sputtering Targets offer excellent adhesion to substrates, promoting film integrity and durability. Their high purity reduces impurities, resulting in high-quality films with enhanced optical and electrical properties. These targets support the production of advanced thin-film devices with exceptional performance and reliability.

Related Product: Iron Manganese Sputtering Target, Manganese Copper Sputtering Target

Manganese Platinum Sputtering Target Specifications

Compound FormulaMnPt
Molecular Weight250.02
AppearanceSilver Metallic Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Manganese Platinum Sputtering Target Handling Notes

Indium bonding is recommended for the Manganese Platinum Sputtering Target due to certain characteristics, such as brittleness and low thermal conductivity, which can complicate the sputtering process. The material’s low thermal conductivity and susceptibility to thermal shock further underscore the need for appropriate bonding techniques to ensure optimal performance during sputtering.

Manganese Platinum Sputtering Target Application

Semiconductor Manufacturing: Manganese Platinum Sputtering Targets are essential for depositing thin films used in integrated circuits, memory devices, and microprocessors. They ensure precise and reliable electrical connections, significantly enhancing device performance.

Optical Coatings: These targets are employed to produce optical coatings for lenses, mirrors, and displays. They improve light transmission, reduce reflection, and enhance both optical clarity and durability.

Magnetic Storage Devices: In magnetic storage media such as hard disk drives, Manganese Platinum Sputtering Targets facilitate the deposition of thin magnetic films with high coercivity, leading to improved data storage capacity.

Solar Cells: These targets are used in the production of thin-film solar cells, contributing to the creation of efficient and durable photovoltaic layers that enhance sunlight conversion into electricity.

Wear-Resistant Coatings: Manganese Platinum Sputtering Targets are utilized to deposit wear-resistant coatings for cutting tools, automotive components, and aerospace parts, offering enhanced hardness, toughness, and abrasion resistance.

Manganese Platinum Sputtering Target Packaging

We meticulously handle our Manganese Platinum Sputtering Target throughout storage and transportation to ensure that it remains in its original, high-quality condition.

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TFM offers Manganese Platinum Sputtering Targets in a range of forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with maximum density and minimal average grain sizes, making them ideal for semiconductor applications, chemical vapor deposition (CVD), and PVD processes for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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