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ST0097 Molybdenum Aluminium (Mo/Al) Sputtering Target

Chemical Formula: Mo/Al
Catalog Number: ST0097
CAS Number: 7439-98-7 | 7429
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum Aluminium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Molybdenum Aluminium (Mo/Al) Sputtering Target

Introduction

Molybdenum Aluminium (Mo/Al) Sputtering Target is a high-performance composite material developed for thin film deposition in semiconductors, displays, solar cells, and advanced electronics. By combining molybdenum’s excellent electrical conductivity and high melting point with aluminium’s lightweight, corrosion-resistant properties, this target delivers stable sputtering behavior and thin films with tailored mechanical and electrical properties.

Detailed Description

Mo/Al sputtering targets are fabricated using high-purity molybdenum and aluminium, processed through vacuum melting or powder metallurgy to ensure dense, homogeneous microstructures. The combination of metals enables controlled film composition, adjustable resistivity, and enhanced adhesion properties.

  • Composition: Standard ratios include Mo:Al = 90:10 or 80:20 (wt%), with custom compositions available on request.

  • Purity: Available at 99.9% and higher to reduce contamination and improve device reliability.

  • Dimensions: Supplied as circular targets (25–300 mm) or rectangular plates, thicknesses 3–6 mm, customized for compatibility with various sputtering systems.

  • Bonding: Indium or elastomer bonding to copper/titanium backing plates ensures efficient heat transfer and longer target lifetime.

  • Microstructure: Fine-grain, dense materials minimize arcing and enable stable deposition.

Applications

Mo/Al sputtering targets are widely applied in:

  • Semiconductors – Conductive and barrier layers in integrated circuits.

  • Thin Film Transistors (TFT-LCD, OLED) – Electrodes and wiring layers.

  • Photovoltaics – Back contact layers in thin film solar cells.

  • Optical Coatings – Reflective and protective coatings in advanced optics.

  • R&D – Experimental thin films for materials science and next-generation electronics.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity≥ 99.9%Ensures minimal contamination in thin films
Diameter25 – 300 mm (custom)Fits most commercial sputtering systems
Thickness3 – 6 mmAffects sputtering efficiency
BondingCopper / Titanium backingImproves thermal and mechanical stability
Mo:Al Composition90:10, 80:20, or customEnables tuning of electrical/optical properties

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Mo/Al Alloy TargetBalanced conductivity & corrosion resistanceTFT, semiconductors
Pure Molybdenum TargetHigh conductivity, high melting pointMicroelectronics, solar cells
Pure Aluminium TargetLightweight, corrosion resistanceOptical & decorative coatings

FAQ

QuestionAnswer
Can the Mo:Al ratio be customized?Yes, compositions can be tailored to meet specific film requirements.
What is the lead time?Typically 2–3 weeks, depending on specifications.
Do you offer bonding services?Yes, indium or elastomer bonding with Cu/Ti backing plates is available.
How are targets packaged?Vacuum-sealed, cushioned with protective foam, and shipped in export-safe cartons or wooden crates.
Which industries use Mo/Al targets most?Semiconductors, display technologies, solar energy, and advanced R&D.

Packaging

Each Molybdenum Aluminium Sputtering Target is vacuum-sealed to protect against oxidation and moisture. They are externally labeled for traceability and securely packed with foam inserts inside export-grade cartons or wooden crates to ensure safe delivery.

Conclusion

Molybdenum Aluminium (Mo/Al) Sputtering Targets combine the thermal stability of molybdenum with the lightweight, corrosion-resistant characteristics of aluminium, making them ideal for thin film deposition in electronics, displays, and photovoltaics. With high purity, customizable compositions, and strong deposition stability, they provide a dependable solution for both industrial and research applications.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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