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ST0097 Molybdenum Aluminium (Mo/Al) Sputtering Target

Chemical Formula: Mo/Al
Catalog Number: ST0097
CAS Number: 7439-98-7 | 7429
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum Aluminium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Aluminium (Mo/Al) Sputtering Target Description

TFM offers Molybdenum Aluminium (Mo/Al) sputtering targets that are precision-engineered for high-performance thin film deposition. These alloy targets combine the excellent thermal and mechanical properties of molybdenum (Mo) with the lightweight conductivity and reactivity of aluminum (Al), making them ideal for use in microelectronics, display coatings, barrier layers, and contact materials.

Mo/Al alloy targets are particularly suited for applications requiring:

  • Thermal and chemical stability in high-temperature environments

  • Tunable electrical resistivity for contact and barrier films

  • Improved adhesion to substrates in multilayer deposition systems

  • Reactive or inert atmosphere sputtering processes (e.g., PVD, DC magnetron)

Molybdenum Aluminium Sputtering Target Specification

PropertyValue
Chemical FormulaMo/Al Alloy (e.g., 70:30, 80:20, 50:50 by weight or atomic %)
Purity≥ 99.9% (3N) total metal basis
FormAlloyed or composite sputtering target
AppearanceSilver-gray metallic solid
Density~7.5–9.5 g/cm³ (depending on composition)
Melting PointDepends on alloy ratio (Mo: 2623 °C; Al: 660 °C)
Available SizesDia.: 1″, 2″, 3″, 4″, 5″, 6″
Thick: 0.125″, 0.250″ or per request
Compositions OfferedMo:Al = 70:30, 80:20, 90:10, or custom ratios
Backing Plate OptionsAvailable with Cu, Mo, or stainless steel backing plates

Customized target sizes and compositions are available upon request.

Mo/Al Sputtering Target Handling Notes

  1. Bonding to a backing plate is strongly recommended to reduce cracking and ensure thermal transfer during deposition.

  2. Avoid exposure to moisture or air for extended periods; store in an inert environment.

  3. Handle with gloves to prevent surface contamination.

Molybdenum Aluminium Sputtering Target Packaging

TFM’s Mo/Al sputtering targets are vacuum-sealed or packaged under inert gas to prevent oxidation. Each item is cushioned and boxed securely to avoid mechanical damage during transportation. Clear labeling ensures traceability, including batch number, composition, and purity.

Get Contact

At TFM, we manufacture and supply Molybdenum Aluminium sputtering targets with custom alloy ratios, sizes, purities, and bonding configurations tailored to your deposition system.
Contact us today for a quote or to learn more about integrating Mo/Al alloys into your next thin film project.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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