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ST0888 Molybdenum Niobium Sputtering Target, Mo/Nb

Molybdenum Niobium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Niobium Sputtering Target Description

The Molybdenum Niobium Sputtering Target is a solid material used in the sputtering process to deposit thin films of molybdenum and niobium onto substrates. In sputtering, atoms are ejected from the target’s surface and transferred onto the substrate to form a thin film.

The Molybdenum Niobium Sputtering Target is usually fabricated as a disc or plate and positioned within a sputtering chamber. The chamber is then filled with an inert gas, such as argon, and a high voltage is applied to the target. This causes gas ions to accelerate towards the target’s surface, ejecting atoms that are then deposited onto the substrate to create a thin film.

Molybdenum Niobium Sputtering Target Specifications

Compound FormulaMo/Nb
AppearanceGray metallic target
Melting Point~2296℃
Density9.2 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Molybdenum Niobium Sputtering Target Handling Notes

Indium bonding is recommended for the Molybdenum Niobium Sputtering Target because its inherent properties, such as brittleness and low thermal conductivity, make it less suited for sputtering applications. The material’s low thermal conductivity also makes it prone to thermal shock, so indium bonding helps enhance its performance and durability.

Molybdenum Niobium Sputtering Target Application

The Molybdenum Niobium Sputtering Target provides precise control over film thickness and uniformity, making it crucial for a range of thin film deposition applications. It is widely used in fields such as optoelectronics, integrated circuits, solar cells, and magnetic recording media.

Molybdenum Niobium Sputtering Target Packaging

We meticulously handle our Molybdenum Niobium Sputtering Targets during storage and transportation to ensure they retain their quality and remain in their original condition.

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TFM offers Molybdenum Niobium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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