ST0043 N-type Silicon Sputtering Target (N-doped Si)

Chemical Formula: N-type Silicon
Catalog Number: 
ST0043
CAS Number: 
7440-21-3
Purity: 
99.9%
Shape: 
Discs, Plates, Column Targets, Step Targets, Custom-made

N-type Silicon sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

N-type Silicon Sputtering Target Description

SiliconThe N-type silicon sputtering target is dark gray with a bluish tinge. Silicon, symbolized as “Si,” derives its name from the Latin word ‘silex’ or ‘silicis,’ meaning flint. It was first mentioned in 1824 and discovered by J. Berzelius, who also accomplished its isolation. Silicon has an atomic number of 14 and is located in Period 3, Group 14 of the periodic table, within the p-block. Its relative atomic mass is 28.0855 Daltons, with the number in brackets indicating the measurement uncertainty.

N-type Silicon Sputtering Target Specification

Material TypeN-type Silicon
SymbolSi
Color/AppearanceDark Gray with a Bluish Tinge, Semi-Metallic
Melting Point1,410 °C
Density2.32 g/cc
Thermal Conductivity150 W·m-1·K-1 (25°C)
Thermal Expansion2.6 x 10-6/K (25°C)
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

N-type Silicon Sputtering Target Bonding Services

Specialized bonding services for N-type Silicon Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

N-type Silicon Sputtering Target Application

Applications of N-Type Silicon Sputtering Target

The N-type silicon sputtering target is used in various applications, including:

  • Thin film deposition
  • Decoration
  • Semiconductor manufacturing
  • Displays
  • LED and photovoltaic devices
  • Functional coatings
  • Optical information storage
  • Glass coating for automotive and architectural glass
  • Optical communications

Other Applications of Silicon

  • Solar Cells: Silicon is a key material in the production of solar cells.
  • Transistors: Widely used in the manufacturing of transistors.
  • Semiconductors: Essential in semiconductor devices.
  • Rectifiers and Solid-State Devices: Used extensively in electronics and space sectors for rectifiers and other solid-state devices.

N-type Silicon Sputtering Target Packaging

Our N-type silicon sputter coater targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, ensuring the targets remain in pristine condition.

Get Contact

TFM offers N-type Silicon Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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