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ST0928 Neodymium Fluoride Sputtering Target, NdF3

Chemical FormulaNdF3
Catalog No.ST0928
CAS Number13709-42-7
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Neodymium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Neodymium Fluoride Sputtering Target Description

Neodymium Fluoride Sputtering Target is a material used in the process of sputtering for depositing thin films onto a substrate. Neodymium fluoride is a compound composed of neodymium (Nd) and fluorine (F) ions. In the sputtering process, high-energy ions bombard the surface of the neodymium fluoride sputtering target, causing atoms or molecules to be ejected. These ejected particles then deposit onto a substrate, forming a thin film with properties inherited from the target material.

Sputtering targets come in different shapes and sizes based on the requirements of the thin film deposition process and the sputtering equipment used. The choice of a neodymium fluoride sputtering target depends on the desired properties of the thin film and its intended applications, which may include optics, electronics, or other advanced materials.

Related Product: Neodymium Strontium Manganate Sputtering Target

Neodymium Fluoride Sputtering Target Specifications

Compound FormulaNdF3
Molecular Weight201.24
AppearanceGray target
Melting Point (℃)1,374
Density (g/cm3)6.5
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Neodymium Fluoride Sputtering Target Handling Notes

Indium bonding is recommended for Neodymium Fluoride Sputtering Targets due to the material’s characteristics that may pose challenges during sputtering, such as brittleness and low thermal conductivity. Neodymium fluoride has low thermal conductivity and is susceptible to thermal shock, making indium bonding a suitable choice to mitigate these issues and ensure effective sputtering performance.

Neodymium Fluoride Sputtering Target Application

Neodymium Fluoride Sputtering Targets are employed in various applications:
  • Optical Coatings: Neodymium fluoride thin films are utilized in optics for anti-reflective coatings and interference filters.
  • Semiconductor Manufacturing: They are used in the fabrication of certain electronic and optoelectronic devices.
  • Research and Development: Neodymium fluoride thin films are applied in various research and development endeavors.

These applications benefit from the unique properties of Neodymium Fluoride, including its optical characteristics and its role in advanced materials development.

Neodymium Fluoride Sputtering Target Packaging

Our Neodymium Fluoride Sputtering Target is widely used in the production of coatings for diverse applications, including enhancing optical properties, improving the performance of semiconductor devices, and supporting research and development projects. Its versatility makes it suitable for various uses, such as improving the wear resistance of tools, enhancing the durability of surfaces, or achieving specific optical and electrical characteristics in thin films.

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TFM offers Neodymium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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