Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Neodymium Strontium Manganate Sputtering Target

ST0461 Neodymium Strontium Manganate Sputtering Target

Chemical Formula: Nd(1-x)SrxMnO3
Catalog Number: ST0461
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Neodymium Strontium Manganate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Neodymium Strontium Manganate Sputtering Target

Introduction

Neodymium Strontium Manganate Sputtering Target is a complex perovskite oxide material widely studied for its rich electrical, magnetic, and transport properties. By partially substituting strontium into neodymium manganate, this material exhibits tunable conductivity, magnetoresistance, and phase behavior, making it highly valuable in oxide electronics and functional thin film research. As a sputtering target, Neodymium Strontium Manganate enables reproducible deposition of high-quality manganite thin films for both academic and industrial R&D applications.

Detailed Description

Our Neodymium Strontium Manganate Sputtering Targets are manufactured from carefully synthesized ceramic powders with precisely controlled stoichiometry. Accurate control of the Nd–Sr–Mn–O composition is essential, as small variations in strontium content can significantly influence electrical conductivity, Curie temperature, and magnetoresistive behavior in the resulting films.

The targets are produced through optimized calcination and high-temperature sintering processes to achieve high density and uniform microstructure. A dense, homogeneous ceramic minimizes arcing, particle generation, and composition drift during RF sputtering, ensuring stable plasma conditions and consistent film quality. Targets can be supplied in standard round or rectangular formats, either unbonded or bonded to metallic backing plates for improved thermal management under higher sputtering power.

Applications

Neodymium Strontium Manganate Sputtering Targets are mainly used in advanced functional oxide thin film applications, including:

  • Colossal magnetoresistance (CMR) and manganite thin film research

  • Spintronic and magnetic oxide devices

  • Electrodes for oxide electronics and heterostructures

  • Functional layers in sensors and MEMS devices

  • Solid-state physics and strongly correlated electron studies

  • Academic and industrial R&D on perovskite oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionNd₁₋ₓSrₓMnO₃ (custom Sr content)Tunes electrical and magnetic properties
Purity99.9% – 99.99%Reduces impurity-induced defects
Diameter25 – 200 mm (custom available)Compatible with standard sputtering guns
Thickness3 – 6 mmAffects target lifetime and sputtering rate
Density≥ 95% theoreticalImproves plasma stability and film uniformity
Sputtering ModeRF sputteringRequired for ceramic oxides
BondingUnbonded / Cu or Ti backing (optional)Enhances heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Neodymium Strontium ManganateTunable magnetoresistanceSpintronics & CMR research
Lanthanum Strontium Manganate (LSMO)Well-studied conductivityOxide electrodes
Neodymium Manganate (NdMnO₃)Strong magnetic orderingMagnetic oxide films
Calcium-Doped ManganatesDifferent carrier concentrationTransport studies

FAQ

QuestionAnswer
Can the Sr doping level be customized?Yes, the strontium content (x value) can be tailored to your requirements.
Is RF sputtering necessary for this target?Yes, as a ceramic oxide, RF sputtering is typically required.
Are bonded targets available?Yes, bonding to copper or titanium backing plates can be provided on request.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or wooden crates.

Packaging

Our Neodymium Strontium Manganate Sputtering Targets are carefully labeled and vacuum-sealed to ensure traceability and protection from moisture or contamination. Robust packaging is used to prevent damage during storage and international transportation.

Conclusion

Neodymium Strontium Manganate Sputtering Target offers a reliable solution for depositing high-quality manganite thin films with tunable electrical and magnetic properties. With precise composition control, high density, and flexible customization options, it is well suited for cutting-edge oxide electronics and spintronic research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Reviews

There are no reviews yet.

Be the first to review “ST0461 Neodymium Strontium Manganate Sputtering Target”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top