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Nickel Copper Sputtering Target

ST0103 Nickel Copper Sputtering Target, Ni/Cu

Chemical Formula: Ni/Cu
Catalog Number: ST0103
CAS Number: 7440-02-0 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel Copper sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Nickel Copper Sputtering Target

Introduction

The Nickel Copper Sputtering Target (Ni-Cu alloy) is a widely used material for thin film deposition in electronics, magnetic storage, optics, and decorative coatings. By combining nickel’s magnetic strength and corrosion resistance with copper’s high electrical and thermal conductivity, the alloy offers a versatile balance of properties for both functional and protective thin films.

Detailed Description

Nickel Copper sputtering targets are produced by methods such as vacuum melting, hot isostatic pressing (HIP), or powder metallurgy, ensuring high density and uniform microstructure. Common alloy ratios include Ni:Cu = 70:30 (Monel-type) or other tailored compositions depending on specific thin film requirements.

Key features:

  • High Purity (≥99.9%): Ensures defect-free, reliable thin films.

  • Custom Alloy Composition: Adjustable Ni-Cu ratios to optimize conductivity, corrosion resistance, or magnetic behavior.

  • Durable Films: Corrosion-resistant coatings, even in harsh marine or chemical environments.

  • Planar or Rotary Options: Compatible with various magnetron sputtering systems.

  • Optional Bonding: Copper or titanium backing plates for enhanced thermal management and mechanical stability.

Applications

Nickel Copper sputtering targets are utilized across multiple advanced industries:

  • Magnetic Storage Media: Thin films for hard disks and memory devices.

  • Electronics & Microcircuits: Conductive, barrier, and functional thin film layers.

  • Optical Coatings: Reflective and protective layers for optics and sensors.

  • Decorative Coatings: Corrosion-resistant metallic finishes for jewelry, watches, and consumer products.

  • Marine & Aerospace: Protective thin films resistant to seawater and extreme environments.

  • Research & Development: Thin film studies in magnetics, corrosion resistance, and microelectronics.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity improves thin film quality
CompositionNi:Cu = 70:30 (customizable)Alloy ratio defines film conductivity & corrosion resistance
Diameter25 – 300 mm (customizable)Fits magnetron sputtering holders
Thickness3 – 6 mmInfluences deposition rate & uniformity
BondingCopper / Titanium backingEnhances heat transfer & structural stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Nickel Copper (Ni-Cu)Balanced conductivity & corrosion resistanceElectronics, optics, decorative coatings
Pure Nickel (Ni)Strong magnetic propertiesMagnetic storage, sensors
Pure Copper (Cu)Highest electrical conductivityElectrical interconnects, EMI shielding

FAQ

QuestionAnswer
Can the Ni:Cu ratio be customized?Yes, the alloy composition (e.g., 70:30, 60:40) can be tailored for specific needs.
Do I need a bonded target?For larger-diameter targets, bonding to copper or titanium backing is recommended.
How is it packaged?Vacuum-sealed or argon-filled, with protective foam and export-safe cartons or crates.
What is the delivery time?Standard lead time is 3–4 weeks depending on specifications.
Which industries use it most?Semiconductor, optics, decorative coatings, marine/aerospace, and R&D.

Packaging

Nickel Copper sputtering targets are vacuum-sealed or argon-protected to prevent oxidation. Each piece is labeled with composition, purity, dimensions, and batch number for traceability. Export-safe cartons or wooden crates ensure secure shipping.

Conclusion

The Nickel Copper Sputtering Target delivers a reliable combination of conductivity, corrosion resistance, and durability, making it ideal for applications in electronics, optics, magnetic storage, and decorative coatings. Its customizable composition and compatibility with various sputtering systems make it a trusted choice for both research and industrial production.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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