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Nickel(II) Oxide Evaporation Materials

VD0718 Nickel(II) Oxide Evaporation Materials, NiO

Catalog No.VD0718
MaterialNickel Oxide (NiO)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity nickel(II) oxide evaporation materials, along with an extensive range of other evaporation materials. We provide these materials in both powder and granule forms, with the option for customized shapes to meet specific needs.

MSDS File

Nickel(II) Oxide Evaporation Materials Overview

Nickel(II) oxide (NiO) is a high-purity oxide evaporation material crucial for producing top-quality thin films in deposition processes. Known for its superior purity, reaching up to 99.9995%, nickel(II) oxide is essential in ensuring reliable performance in various applications. TFM is dedicated to manufacturing this material with stringent quality assurance processes to deliver consistent and dependable results.

Specifications of Nickel(II) Oxide Evaporation Materials

Material TypeNickel(II) oxide
SymbolNiO
Color/AppearanceGreen solid
Melting Point1,955 °C
Theoretical Density 6.67 g/cm3
Purity99.9%
ShapePowder/ Pellets/ Granule/ Custom-made

Applications of Nickel(II) Oxide Evaporation Materials

Nickel(II) oxide is widely utilized in a variety of applications, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Used in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Quality Assurance

To maintain the highest quality standards, nickel(II) oxide evaporation materials are carefully tagged and labeled for easy identification. Packaging is designed to protect the materials from any potential damage during storage and transportation, ensuring they arrive in perfect condition.

Contact Us

TFM is a leading supplier of high-purity nickel(II) oxide evaporation materials, available in various shapes including tablets, granules, rods, and wires. Customized forms and quantities can also be arranged to meet your specific requirements. In addition to evaporation materials, we offer a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about pricing or materials not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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