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Nickel Telluride Evaporation Materials

VD0867 Nickel Telluride Evaporation Materials, NiTe

Catalog No.VD0867
MaterialNickel Telluride (NiTe)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of manufacturing and supplying premium high-purity nickel telluride evaporation materials. We offer a comprehensive range of evaporation materials, available in both powder and granule forms. For specialized needs, we also provide custom formulations to meet specific requirements.

MSDS File

Nickel Telluride Evaporation Materials Overview

Nickel telluride, with the chemical formula NiTe, is a specialized ceramic material used in evaporation processes. Known for its high purity, NiTe is crucial in producing high-quality thin films. At TFM, we offer nickel telluride evaporation materials with a purity of up to 99.9995%, ensuring reliable and consistent performance for various applications.

Nickel Telluride Evaporation Materials Specification

Material TypeNickel Telluride
SymbolNiTe
Appearance/ColorGray solid
Melting PointN/A
Density7.3 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Nickel telluride evaporation materials are widely used in deposition techniques such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are particularly useful in optical applications, including wear protection, decorative coatings, and display technologies.

Packaging Information

To maintain the quality and integrity of our nickel telluride evaporation materials, they are securely packaged in plastic vacuum bags. This packaging helps prevent damage during storage and transit. Additionally, each product is accompanied by a Certificate of Analysis (COA) to verify its quality.

Contact Us

TFM is dedicated to providing high-purity nickel telluride evaporation materials tailored for use in semiconductors, CVD, PVD, and optical applications. Our expertise in engineering, manufacturing, and analysis ensures that our products meet industry-leading standards. For inquiries or more information, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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