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Nickel Telluride Evaporation Materials

VD0867 Nickel Telluride Evaporation Materials, NiTe

Catalog No.VD0867
MaterialNickel Telluride (NiTe)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of manufacturing and supplying premium high-purity nickel telluride evaporation materials. We offer a comprehensive range of evaporation materials, available in both powder and granule forms. For specialized needs, we also provide custom formulations to meet specific requirements.

MSDS File

Introduction

Nickel Telluride (NiTe) Evaporation Materials are compound semiconductor sources used in physical vapor deposition (PVD) for producing nickel–tellurium thin films with controlled composition and functional electronic properties. As a transition-metal telluride, NiTe is of growing interest in optoelectronics, thermoelectric research, and phase-change or functional chalcogenide systems where precise stoichiometry and film uniformity are essential.

Detailed Description

NiTe evaporation materials are synthesized from high-purity nickel and tellurium with strict stoichiometric control to ensure a stable Ni:Te ratio. Advanced synthesis and consolidation processes are employed to minimize impurities, reduce volatile loss, and improve evaporation stability under high vacuum.

Nickel telluride can be deposited using thermal evaporation or electron-beam evaporation, depending on system configuration and desired deposition rate. Careful control of source temperature and evaporation rate helps maintain film composition and surface smoothness. Compared with depositing nickel and tellurium separately, using a compound NiTe evaporation source simplifies process control and improves batch-to-batch reproducibility.

NiTe thin films exhibit tunable electrical conductivity, good adhesion to common substrates, and compatibility with multilayer chalcogenide stacks. These characteristics make NiTe evaporation materials suitable for both exploratory research and prototype device fabrication.

Applications

Nickel Telluride evaporation materials are commonly used in:

  • Chalcogenide thin films: Functional Ni–Te layers and compound semiconductors

  • Thermoelectric research: Nickel-based telluride materials and heterostructures

  • Optoelectronics: Functional layers in photonic and electronic devices

  • Phase-change and functional materials: Research on telluride-based systems

  • Thin-film sensors: Electrically responsive coatings

  • Academic & industrial R&D: Materials science and device development

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionNiTe (Nickel Telluride)Defines electrical & structural properties
Purity99.9% – 99.99%Reduces defects and contamination
StoichiometryNi:Te ≈ 1:1Ensures consistent film behavior
FormPieces, pellets, granulesCompatible with evaporation sources
Evaporation MethodThermal / E-beamFlexible PVD integration
Application TypeThin-film depositionSemiconductor & functional coatings

Comparison with Related Telluride Materials

MaterialKey AdvantageTypical Application
NiTeStable Ni–Te compound, tunable conductivityFunctional telluride films
Bi₂Te₃High thermoelectric performanceThermoelectric devices
Sb₂Te₃Phase-change functionalityMemory & optics
CdTeDirect bandgap semiconductorPhotovoltaics

FAQ

QuestionAnswer
Can NiTe evaporation materials be customized?Yes, purity, form, and batch size can be tailored.
Which evaporation method is recommended?Both thermal and electron-beam evaporation are commonly used.
Is stoichiometry stable during evaporation?Controlled evaporation parameters help maintain Ni:Te balance.
How are the materials packaged?Vacuum-sealed with moisture- and contamination-resistant protection.

Packaging

Our Nickel Telluride Evaporation Materials (NiTe) are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each batch is vacuum-sealed and protected with reinforced cushioning to prevent oxidation, tellurium loss, or mechanical damage during storage and transportation.

Conclusion

Nickel Telluride Evaporation Materials (NiTe) provide a reliable and controllable source for depositing nickel–tellurium thin films with consistent composition and functional performance. With flexible evaporation formats, stable material quality, and customization options, NiTe is well suited for advanced research and emerging chalcogenide thin-film applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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