Product Overview
Nickel Tungsten Sputtering Target (Ni/W) is an alloy sputtering target used to deposit composition-controlled alloy films. Relative to a pure elemental target, the alloying constituents are introduced to tune electrical, magnetic, optical, mechanical, or adhesion-related film properties. For this reason, alloy ratio, homogeneity, purity basis, and the intended film composition should be defined clearly in the procurement specification.
Material and Deposition Characteristics
Many alloy targets are electrically conductive and can be compatible with DC or pulsed-DC magnetron sputtering, subject to the actual alloy composition and equipment capability. The target composition is not always reproduced exactly in the deposited film because preferential sputtering, re-sputtering, substrate heating, and process gas conditions can shift the final ratio. For composition-sensitive work, deposited-film analysis should be part of process qualification.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Composition | Ni/W (e.g., 80/20, 70/30 wt%) | Determines film properties |
| Purity | 99.9% ā 99.99% | Ensures consistent deposition |
| Density | ā„ 98% theoretical | Improves sputtering stability |
| Diameter | 50 ā 300 mm (custom available) | Compatible with sputtering systems |
| Thickness | 3 ā 6 mm | Affects target lifetime |
| Bonding | Copper backing / Indium bonding | Enhances thermal conductivity |
| Microstructure | Fine, homogeneous | Reduces defects and arcing |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Nickel Tungsten (Ni/W) | Balanced hardness and corrosion resistance | Functional and protective coatings |
| Nickel (Ni) | High conductivity, ductility | Conductive layers |
| Tungsten (W) | Extreme hardness, high melting point | High-temperature coatings |
| Question | Answer |
|---|---|
| Can Ni/W sputtering targets be customized? | Yes, composition ratios, size, and bonding options can be tailored to your requirements. |
| What sputtering method is suitable for Ni/W? | Both DC and RF magnetron sputtering can be used depending on system configuration. |
| What is the advantage of alloying Ni with W? | It improves hardness, wear resistance, and thermal stability while maintaining good sputtering performance. |
| Are bonded targets necessary? | For high-power applications, bonded targets improve heat dissipation and structural stability. |
| Which industries use Ni/W targets most? | Semiconductor, energy, aerospace, and advanced coating industries. |
Typical Thin-Film Applications
- Nickel Tungsten alloy films where composition control is important to electrical, mechanical, magnetic, or optical performance
- Multilayer stacks, adhesion/barrier layers, conductive films, or functional coatings depending on the alloy system
- Research and production programs that require customized alloy ratios and repeatable sputtering behavior
Target Configuration and Ordering Considerations
For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.
Frequently Asked Questions
Can the composition of a Nickel Tungsten sputtering target be customized?
Yes. For alloy targets, the required ratio should be specified clearly in wt% or at%. TFM can review custom compositions together with purity, dimensions, and manufacturability.
Will an alloy target always produce a film with the same composition?
Not necessarily. Preferential sputtering, substrate heating, process gas, and re-sputtering effects can shift the deposited composition relative to the nominal target chemistry. Film analysis should be used when the composition is critical.
Is a Nickel Tungsten alloy target compatible with DC magnetron sputtering?
Many metallic alloy targets are electrically conductive and can be compatible with DC or pulsed-DC sputtering, but the final choice depends on the actual alloy system and equipment.
Why is alloy homogeneity important in a Nickel Tungsten target?
A uniform alloy distribution helps support stable erosion and reduces local composition variation across the target, which in turn helps improve run-to-run consistency.
Can a Nickel Tungsten target be supplied bonded?
Yes. Where the cathode or thermal load requires it, TFM can supply bonded assemblies. Backing-plate material, target thickness, bonding method, and operating power should be reviewed together.
What should I include in an RFQ for Nickel Tungsten?
Specify the alloy composition, purity basis, dimensions, quantity, backing requirement, cathode model or drawing, and any tolerance, inspection, or documentation requirements.
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