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VD0643 Nickel Vanadium Evaporation Materials, Ni/V

Catalog No.VD0643
MaterialNickel Vanadium (Ni/V)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity nickel vanadium evaporation materials, as well as a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, with options for customization to meet your specific requirements.

MSDS File

Nickel Vanadium Evaporation Materials Description

TFM offers high-purity nickel vanadium evaporation materials, an alloy containing nickel (Ni) and vanadium (V). These materials are essential in deposition processes, ensuring the production of high-quality films. Our nickel vanadium materials can achieve up to 99.9995% purity, thanks to our stringent quality assurance procedures that ensure product reliability.

Related Products: Nickel Evaporation Materials, Vanadium Evaporation Materials

Applications of Nickel Vanadium Evaporation Materials

Nickel vanadium evaporation materials are utilized in various advanced applications, including:

  • Deposition processes such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications, including wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

We handle our nickel vanadium evaporation materials with care to avoid damage during storage and transportation. This meticulous approach helps maintain the quality and integrity of our products.

Contact Us

As a leading provider of high-purity nickel vanadium evaporation materials, TFM offers these products in various forms, including tablets, granules, rods, and wires. We also accommodate custom shapes and quantities to meet your specific needs. Additionally, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about products not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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