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Niobium Nitride Sputtering Target, NbN

Niobium Nitride Sputtering Target, NbN

Material: Niobium Nitride Sputtering Target
Formula: NbN
Catalog No.: TFM-SPT-0457

NbN compound target for Nb-N film development. Specify phase and nitrogen basis, cathode fit, and film-composition acceptance. Grade, dimensions, assembly, documentation and availability are confirmed in the quotation.

What is a niobium nitride sputtering target?

A niobium nitride (NbN) sputtering target is a compound source for Nb-N thin-film research. The target's nitrogen content and phase should be defined separately from the deposited film's nitrogen balance and functional properties.


niobium
Nitrogen

Material and Deposition Characteristics

The appropriate sputtering mode depends on target conductivity, thermal behavior, and the power-supply configuration. Many compound ceramic targets are evaluated first with RF magnetron sputtering, especially when electrical resistivity is high. For brittle or low-thermal-conductivity materials, density, backing support, and stable cooling are important for reliable operation.

How to specify niobium nitride sputtering target for an RFQ

The following fields define the order and the tests needed to qualify this target; final availability and acceptance criteria belong in the approved quotation or drawing.

DecisionInformation to provide or verify
Material identitySpecify Nb:N composition or phase, impurity limits, and any target-density evidence required for the project.
Target and cathode fitProvide target dimensions, cathode mounting and cooling details, and the intended power or reactive-gas context.
Film acceptanceDefine film nitrogen content, phase, thickness, and relevant electrical or structural checks under the actual recipe.

Send the specification and drawing for review. The selected source or target and the deposited film require separate acceptance evidence.

Browse the Sputtering Targets catalog for the broader material and source family.

Research applications and film checks

  • Ultrathin NbN films are investigated for superconducting nanowire single-photon detectors. Published work often uses reactive sputtering from an Nb metal source; that route is not automatically equivalent to sputtering a pre-compounded NbN target (research example).
  • For a detector-film project, define the required film thickness, nitrogen content and phase, superconducting transition and electrical tests under the chosen deposition route.
  • Specify the target composition/phase, cathode fit and power/atmosphere context separately from the device acceptance criteria; target identity alone cannot guarantee superconducting performance.

Target Configuration and Ordering Considerations

When requesting a quotation, provide target diameter or rectangular dimensions, thickness, purity or composition, required quantity, and whether a backing plate or bonded assembly is needed. For brittle ceramic or compound targets, it is useful to specify the cathode model, backing-plate material, preferred bonding method, operating power if known, and any density, tolerance, or inspection-document requirements. TFM can review drawings, old-target photos, and application details when custom dimensions are required.

Frequently Asked Questions

What is the main reason to use a Niobium Nitride sputtering target?

It provides a composition-specific source for depositing thin films when the required chemistry is better introduced from a pre-compounded target than from co-sputtering separate elements.

How should the sputtering mode for Niobium Nitride be selected?

The power mode should be selected from target conductivity, thermal behavior, and equipment capability. Many compound ceramic targets are first evaluated with RF magnetron sputtering.

Why are density and microstructure important for Niobium Nitride targets?

Uniform density and microstructure help support stable erosion and thermal behavior, while pores or local defects can increase the risk of cracking, particles, or unstable plasma.

Can a Niobium Nitride target be supplied with a backing plate?

Yes. Where the material is brittle or the cathode requires a backing assembly, bonded configurations can be reviewed according to target size, thickness, cooling, and operating power.

Does target composition always equal film composition?

No. Film chemistry can shift because of different sputtering yields, reactive conditions, substrate temperature, re-sputtering, or chamber history. Verify the film when the chemistry is critical.

What should I provide to request a quotation for Niobium Nitride?

Please provide material composition, purity, dimensions, quantity, target or backing configuration, cathode model or system details, and any drawing, tolerance, or inspection requirements.

Prepare your RFQ: Download the fillable Niobium Nitride Sputtering Target, NbN RFQ Worksheet (PDF). Enter the required composition or grade, dimensions, backing or bonding request, quantity, documents, and acceptance criteria for quotation review.

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NbN target ø4"×6mm 3N, Ø3" × 3 mm, Niobium Nitride (NbN), 3N, Bonded to 2 mm Cu B/P

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

Manufacturing routes depend on the material and target specification. Metal targets may be cast and machined, while some ceramic targets are consolidated by sintering. Ask for the product-specific route and inspection criteria when these affect qualification.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Bonding may be selected for brittle targets, thinner precious-metal targets, or a cathode that needs a specific backing and cooling arrangement. It is not a universal requirement. Provide target and backing dimensions, the cathode model, and operating conditions for assembly review.

 

DC is commonly used with conductive targets. RF is often used for poorly conducting or insulating targets to mitigate surface charging; other power modes may be suitable depending on the target, cathode, and process. Confirm the mode against the equipment and material.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Customer-supplied powder acceptance is not assumed. Provide material identity, lot traceability, composition and impurity analysis, quantity, and handling constraints in the RFQ. TFM must confirm feasibility and acceptance criteria before any material is sent.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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