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ST0897 Niobium Stannide Sputtering Target, Nb3Sn

Chemical FormulaNb3Sn
Catalog No.ST0897
CAS Number12035-04-0
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Niobium Stannide Sputtering Target   come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Niobium Stannide Sputtering Target Description

The Niobium Stannide Sputtering Target is used to create thin films or coatings composed of a niobium (Nb) and tin (Sn) compound in a 3:1 ratio. This target is widely utilized in physical vapor deposition (PVD) techniques to deposit thin films onto various substrates.

The Nb₃Sn compound is a superconducting material with a high critical temperature of around 18 K. Its exceptional superconducting properties make it well-suited for applications in superconducting magnets, high-energy particle accelerators, and other advanced electronic devices.

Niobium Stannide Sputtering Target Specifications

Compound FormulaNb3Sn
AppearanceDark gray target
Molecular Weight397.43
Density5.7 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Niobium Stannide Sputtering Target Handling Notes

Indium bonding is recommended for the Niobium Stannide Sputtering Target due to its properties that can complicate sputtering, such as brittleness and low thermal conductivity. The target’s low thermal conductivity makes it prone to thermal shock, so indium bonding helps enhance its performance and stability during the sputtering process.

Niobium Stannide Sputtering Target Application

The Niobium Stannide Sputtering Target is essential for various technological applications and research areas, particularly in the development of superconducting devices and advanced electronic systems.

Niobium Stannide Sputtering Target Packaging

We ensure that our Niobium Stannide Sputtering Targets are meticulously handled during storage and transportation to maintain their quality and preserve them in their original condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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