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Niobium Zirconium Sputtering Target

Niobium Zirconium Sputtering Target

Niobium Zirconium Sputtering Target

Introduction

The Niobium Zirconium Sputtering Target is a specialized alloy material designed for thin film deposition in advanced coating applications. By combining the ductility and corrosion resistance of zirconium with the excellent superconducting and high-temperature stability of niobium, this target provides a reliable solution for industries requiring superior thin film performance. Its tailored composition makes it an attractive choice for research institutions, semiconductor fabrication, and energy technologies.

Detailed Description

Niobium Zirconium sputtering targets are manufactured from high-purity raw materials using advanced powder metallurgy, hot isostatic pressing (HIP), and precision machining. The alloy ratio can be adjusted depending on customer requirements, offering a balance of electrical, thermal, and mechanical properties.

  • Microstructure & Density: Optimized processing ensures a fine, uniform grain structure and high density, which contribute to consistent sputtering rates and film uniformity.

  • Purity: Typical purity levels reach 99.9% or higher, critical for avoiding impurities in functional coatings.

  • Form Factors: Available in standard disc, rectangular, or step targets, with customization possible in size, thickness, and bonding.

  • Bonding Options: Indium bonding to copper or titanium backplates improves heat dissipation and mechanical stability during high-power sputtering.

Applications

Niobium Zirconium Sputtering Targets are widely applied in:

  • Semiconductors – barrier layers, microelectronic devices, and advanced logic chips.

  • Superconducting Films – suitable for magnetic resonance imaging (MRI) devices and particle accelerators.

  • Optical Coatings – for high-durability and anti-corrosion performance.

  • Energy Sector – thin film deposition in fuel cells, hydrogen storage, and advanced energy devices.

  • Aerospace & Defense – protective coatings with excellent thermal stability.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures low contamination in films
Alloy RatioNb:Zr = 90:10 – 50:50 (at%)Tunable properties for applications
Diameter25 – 300 mm (customizable)Fits various sputtering systems
Thickness3 – 10 mmInfluences deposition rate
BondingIndium / Copper / TitaniumEnhances thermal conductivity and target life

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Niobium Zirconium (NbZr)Superconductivity & corrosion resistanceElectronics, energy
Pure NiobiumExcellent superconducting propertiesAccelerators, MRI
Pure ZirconiumStrong corrosion resistanceNuclear & chemical industries
TantalumHigh-temperature stabilitySemiconductors, optics

FAQ

QuestionAnswer
Can the target composition be customized?Yes, Nb:Zr ratios, purity, and size can be tailored.
How are the targets packaged?Vacuum-sealed with protective foam, shipped in export-safe cartons or wooden crates.
What industries use NbZr sputtering targets most?Semiconductor, energy, superconducting research, aerospace, and optics.
Do you provide bonded targets?Yes, we offer indium, copper, or titanium backing options.
What forms are available?Discs, rectangular plates, step targets, and custom designs.

Packaging

Each Niobium Zirconium Sputtering Target is carefully labeled and vacuum-sealed to maintain purity and prevent contamination. Protective foam and robust export-safe packaging ensure safe delivery to your laboratory or production line.

Conclusion

The Niobium Zirconium Sputtering Target is a versatile alloy solution for demanding thin film deposition applications. With its combination of superconducting, corrosion-resistant, and high-temperature stable properties, it serves critical roles in semiconductor manufacturing, optical coatings, and energy devices.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

Order Now

NbZr target 50/50 at% ø50.8×6 mm (4 pcs), NbZr target 50/50 at% ø63×6 mm (2 pcs)

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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