OFHC Copper Gaskets for ConFlat (CF) UHV Flanges
OFHC Copper Gaskets for ConFlat (CF) UHV Flanges, provided by TFM, are designed to offer reliable, high-performance sealing solutions in ultra-high vacuum (UHV) systems. These gaskets are crafted from oxygen-free high conductivity (OFHC) copper, providing exceptional thermal conductivity and minimal outgassing, making them ideal for UHV environments in scientific research, semiconductor processing, and other vacuum-dependent applications.
Key Features
High-Purity OFHC Copper Material
These gaskets are made from oxygen-free high conductivity copper with a purity of over 99.99%, ensuring minimal outgassing and superior thermal conductivity for demanding UHV applications.Metal-to-Metal Seal
Designed to form a leak-tight seal with ConFlat (CF) flanges, these gaskets deliver reliable performance even in vacuum chambers with pressures down to 10⁻¹¹ Torr.Excellent Thermal Conductivity
OFHC copper’s high thermal conductivity ensures efficient heat dissipation in systems with temperature variations, making these gaskets ideal for high-heat and cryogenic applications.Durable and Long-Lasting
OFHC copper’s malleability allows the gasket to conform to flange knife edges, ensuring a tight and reliable seal. The material’s durability also ensures long-lasting performance under varying temperatures.Versatile for Various Applications
These gaskets are suitable for a wide range of applications, from UHV systems to high-temperature and cryogenic conditions, ensuring reliable sealing across different sectors.
Applications
UHV Research and Scientific Equipment
Used extensively in research laboratories for applications such as electron microscopy, spectroscopy, and surface science, where clean and stable vacuum conditions are essential.Semiconductor Manufacturing
Ideal for high-purity vacuum systems in the semiconductor industry, these gaskets help maintain the integrity of vacuum chambers during thin film deposition, sputtering, and other processes.Cryogenic Systems
Suitable for use in cryogenic applications, these gaskets can withstand low-temperature environments while providing excellent sealing and thermal conductivity.Vacuum Chambers and Process Equipment
Essential in vacuum chambers, these gaskets maintain stable and reliable seals in systems used for industrial processes, gas handling, and high-tech applications.
Technical Specifications
Material: Oxygen-Free High Conductivity (OFHC) Copper (annealed)
Purity: Copper >99.99%
Vacuum Rating: Down to 10⁻¹¹ Torr
Temperature Tolerance: Up to 450°C
Flange Compatibility: ConFlat (CF) UHV flanges
Surface Finish: Smooth, burr-free edges for optimal sealing
Usage: Single-use gaskets to ensure maximum sealing integrity
Benefits of OFHC Copper Gaskets
High-Performance Sealing: These gaskets form a strong, reliable seal, making them ideal for UHV applications that require a leak-tight connection.
Superior Thermal Management: Excellent heat conductivity reduces the risk of temperature fluctuations affecting system performance.
Minimal Outgassing: The high purity of the copper ensures low levels of outgassing, essential for maintaining the vacuum integrity in sensitive applications.
Durability in Harsh Conditions: Withstand high temperatures and pressure changes, providing long-lasting sealing performance in demanding environments.
Why Choose TFM?
TFM’s OFHC Copper Gaskets for ConFlat (CF) UHV Flanges are crafted to meet the highest standards of quality and performance. Trusted by researchers, engineers, and industries relying on vacuum systems, these gaskets provide the integrity and reliability needed for the most demanding applications.
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