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Osmium Rubidium Sputtering Target

ST0500 Osmium Rubidium Sputtering Target, Os/Ru

Chemical Formula: Os/Ru
Catalog Number: ST0500
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Osmium Rubidium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Osmium Rubidium Sputtering Target Description

OsmiumOsmium is a chemical element represented by the symbol **Os** and atomic number **76**. It is a hard, brittle, and bluish-white metal belonging to the platinum group. Osmium is found in trace amounts in platinum ores and is known for being the densest naturally occurring element, with a density of 22.59 g/cm³, as determined by X-ray crystallography. Due to its extreme hardness and durability, osmium is commonly used in alloys with platinum, iridium, and other platinum-group metals. These alloys are utilized in manufacturing fountain pen nibs, electrical contacts, and other components that demand high resilience. Despite its utility, osmium is among the rarest elements in the Earth’s crust.

Rubidium Rubidium is a chemical element with the symbol **Rb** and atomic number **37**. It is a very soft, silvery-white metal that belongs to the alkali metal group. Rubidium is similar in appearance and properties to potassium and cesium, exhibiting comparable softness and electrical conductivity. Due to its high reactivity, rubidium cannot be exposed to atmospheric oxygen and moisture; it must be stored in an inert environment to prevent it from reacting with air or water.

Related Products: Osmium Sputtering Target, Rubidium Sputtering Target.

Osmium Rubidium Sputtering Target Specification

Material TypeOsmium Rubidium
SymbolOs/Ru
Color/AppearanceSolid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Osmium Rubidium Sputtering Target Application

The Osmium Rubidium Sputtering Target is utilized in various applications, including:

  • Thin Film Deposition: Creating precise and high-quality thin films for a range of technologies.
  • Decoration: Applying decorative coatings in various industries.
  • Semiconductors: Fabricating components essential for semiconductor devices.
  • Displays: Enhancing the performance and durability of display technologies.
  • LED and Photovoltaic Devices: Contributing to the production of LEDs and solar cells.
  • Functional Coatings: Developing coatings that provide specific functional properties.
  • Optical Information Storage: Used in industries focusing on optical data storage solutions.
  • Glass Coatings: Employed in the automotive glass industry, architectural glass applications, and other glass coatings.

Our targets are meticulously tagged and labeled to facilitate efficient identification and maintain high-quality standards. We ensure that each product is handled with the utmost care to prevent any damage during storage or transportation.

Packing

Our Osmium Rubidium Sputtering Targets are meticulously tagged and labeled to ensure easy identification and rigorous quality control. We take every precaution to prevent any potential damage during storage and transportation, ensuring that each target reaches you in optimal condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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