Perfluoroelastomer (FFKM) Kalrez® O-Rings (0.139 Section): High-Purity Micro Seals for Semiconductor and Plasma Processing
Perfluoroelastomer (FFKM) Kalrez® O-Rings (0.139 section) from TFM deliver unmatched performance in ultra-clean and high-temperature environments, making them ideal for semiconductor manufacturing, reactive plasma systems, and precision chemical processing. These O-rings are manufactured using Kalrez® 4079, a trusted FFKM compound known for its low compression set, low weight loss, and broad chemical resistance.
With a compact 0.139-inch cross-section, this O-ring size is particularly suited for instrumentation ports, gas lines, and miniature sealing points within etch, deposition, or diffusion tools. Kalrez® 4079 withstands continuous operation up to 316°C, enabling it to perform consistently through thermal cycling and plasma exposure.
Product Specifications:
Material Grade: Kalrez® 4079 (FFKM)
Color: Black
Durometer Hardness: 75 Shore A
Cross-Section Diameter: 0.139 inches
Temperature Range: –19°C to +316°C (continuous)
Key Benefits:
Exceptional chemical resistance to acids, solvents, and aggressive plasma byproducts
Low weight loss in reactive plasma environments, minimizing contamination
Excellent sealing memory even under extreme thermal cycling
UHV-compatible, with very low outgassing and particle generation
Designed for semiconductor wet and dry process compatibility
Not Suitable For:
Hot water or steam exposure
Aliphatic amines at high temperatures
Ethylene oxide or propylene oxide
Ideal Applications:
Seals in semiconductor tools (etchers, CVD, ALD)
Miniature gas line seals and instrument connections
Analytical instrumentation exposed to aggressive chemistries
High-purity environments requiring chemical and thermal endurance
TFM’s Kalrez® FFKM O-Rings (0.139 section) are the go-to solution when precision, cleanliness, and extreme chemical durability are mandatory in high-tech and high-temperature sealing applications.
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