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Nickel Antimony Evaporation Material

VD0567A Permalloy Evaporation Material

MSDS File
Material TypePermalloy® †
SymbolNi/Fe/Mo/Mn
Melting Point (°C)1,395
Theoretical Density (g/cc)8.7
FerromagneticMagnetic Material
Z Ratio**1.00
E-BeamGood
Thermal Evaporation TechniquesBoat:  W
Crucible:  Al2O3
E-Beam Crucible Liner MaterialFabmate®‡
Temp. (°C) for Given Vap. Press. (Torr)10-8:  947
10-6:  1,047
10-4:  1,307
CommentsFilm low in Ni.

Permalloy Evaporation Material

TFM offers high-quality Permalloy evaporation material, specifically designed for thin-film deposition applications requiring superior magnetic properties. Permalloy, an alloy primarily composed of nickel (Ni) and iron (Fe), is known for its excellent magnetic permeability, low coercivity, and high saturation magnetization, making it an ideal choice for magnetic films in electronics and sensor technologies.

The evaporation process allows for the precise deposition of Permalloy thin films, which are extensively used in magnetic recording devices, high-frequency components, transformers, and magnetic shielding applications. These films exhibit enhanced magnetic performance, making them ideal for use in inductive components, magnetic heads, and sensor applications where high sensitivity and low noise are crucial.

Permalloy evaporation material is widely used in the manufacture of magnetic layers for high-performance devices, including hard drives, magnetic sensors, and magnetic memory devices. Its low coercivity allows for easy magnetization and demagnetization, making it highly suited for data storage applications. Additionally, Permalloy-based thin films are used in electromagnetic shielding due to their ability to effectively block unwanted electromagnetic interference (EMI).

TFM provides customized Permalloy evaporation materials, ensuring precise control over composition and purity to meet the specific needs of advanced deposition processes. These materials are carefully crafted to ensure optimal evaporation performance, producing high-quality, uniform films for next-generation magnetic devices.

Our Permalloy evaporation materials are manufactured to the highest standards, offering consistent performance and reliable magnetic properties. With low impurity levels, high density, and optimized evaporation characteristics, TFM’s Permalloy materials are perfect for producing high-performance magnetic films in applications requiring superior magnetic properties.

Permalloy Alloy Pellet Details

TFM offers high-purity Permalloy pellets, pieces, and powder with a purity of 99.9%, ensuring top-quality performance for specialized industrial applications.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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