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Platinum Ruthenium Sputtering Target

ST0503 Platinum Ruthenium Sputtering Target, Pt/Ru

Chemical Formula: Pt/Ru
Catalog Number: ST0503
CAS Number: 172515-31-0
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Platinum Ruthenium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Platinum Ruthenium Sputtering Target Description

PlatinumPlatinum is a dense, malleable, and ductile metal, prized for its unreactive nature and silverish-white appearance. The name “platinum” comes from the Spanish term “platino,” meaning “little silver.” Among the six metals in its group—platinum (Pt), palladium (Pd), osmium (Os), iridium (Ir), rhodium (Rh), and ruthenium (Ru)—platinum stands out as the most significant. It remains unaffected by oxygen and water and can only be dissolved in aqua regia or fused alkalis. Platinum’s most notable commercial use is in catalytic converters for vehicles.

Image result for RutheniumRuthenium is a chemical element named after Russia, known by its Latin name “Ruthenia.” It was first mentioned and observed by J. Sniadecki in 1807, who also accomplished its isolation. The chemical symbol for ruthenium is “Ru.” It has an atomic number of 44 and is located in Period 5 and Group 8 of the periodic table, belonging to the d-block. The relative atomic mass of ruthenium is 101.07(2) Dalton, with the number in parentheses indicating the uncertainty.

Related Products: Platinum Sputtering Target, Ruthenium Sputtering Target.

Platinum Ruthenium Sputtering Target Specifications

Material TypePlatinum Ruthenium
SymbolPt/Ru
Color/AppearanceBlack Solid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Platinum Ruthenium Sputtering Target Application

Platinum Ruthenium Sputtering Targets are utilized in a variety of applications including thin film deposition, decoration, semiconductors, displays, LEDs, photovoltaic devices, functional coatings, optical information storage, glass coatings for car and architectural glass, and optical communication.

Platinum Ruthenium Sputtering Target Packing

Our Platinum Ruthenium Sputtering Targets are meticulously tagged and labeled externally to guarantee efficient identification and quality control. We take exceptional care to prevent any potential damage during storage or transportation.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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