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ST0504 Platinum Silver Sputtering Target, Pt/Ag

Chemical Formula: Pt/Ag
Catalog Number: ST0504
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Platinum Silver sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Platinum Silver Sputtering Target Description

PlatinumPlatinum is a dense, malleable, ductile, highly unreactive, precious, silver-white transition metal. The name derives from the Spanish word “platino,” meaning “little silver.” Among the six platinum group metals (Pt, Pd, Os, Ir, Rh, and Ru), platinum is the most significant. It resists corrosion, being unaffected by oxygen and water, and dissolves only in aqua regia or fused alkalis. Its most notable commercial use is as a catalytic converter in vehicles, which helps reduce harmful emissions.

SilverSilver is a soft, white, lustrous transition metal, it exhibits the highest electrical conductivity, thermal conductivity, and reflectivity of any metal. The metal is found in the Earth’s crust in the pure, free elemental form (“native silver”), as an alloy with gold and other metals, and in minerals such as argentite and chlorargyrite. Most silver is produced as a byproduct of copper, gold, lead, and zinc refining. Silver sputtering target is used as decorative coatings and antibiotic coating in medical devices.

Related Products: Platinum Sputtering Target, Silver Sputtering Target.

Platinum Silver Sputtering Target Specifications

Material TypePlatinum Silver
SymbolPt/Ag
Color/AppearanceSolid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Platinum Silver Sputtering Target Application

The Platinum Silver Sputtering Target is utilized for a range of applications including thin film deposition, decorative coatings, semiconductor fabrication, display technologies, LED and photovoltaic devices, as well as functional coatings. It is also employed in various optical information storage industries, glass coating sectors such as automotive and architectural glass, and optical communication technologies.

Platinum Silver Sputtering Target Packing

Our Platinum Silver Sputtering Targets are meticulously tagged and labeled for clear identification and stringent quality control. We take extensive measures to prevent any potential damage during storage and transportation, ensuring that the targets arrive in optimal condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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