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ST0035 Platinum Sputtering Target, Pt

Chemical Formula: Pt
Catalog Number: ST0035
CAS Number: 7440-6-4
Purity: 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

MSDS File

Product Overview

Platinum

TFM offers high-quality Platinum Sputtering Targets designed for exceptional performance in various deposition processes, including semiconductor manufacturing, chemical vapor deposition (CVD), and physical vapor deposition (PVD) for display and optical devices. Known for its superior durability and outstanding catalytic properties, platinum is ideal for high-tech applications requiring high precision and reliability.

Features and Benefits

  • Material Type: Platinum (Pt)
  • Appearance: Metallic Gray
  • Melting Point: 1,772°C
  • Density: 21.45 g/cm³
  • Thermal Expansion: 8.8 x 10⁻⁶/K
  • Electrical Conductivity: High thermal and electrical conductivity, making it ideal for semiconductor applications.
  • Corrosion Resistance: Highly resistant to corrosion and stable at high temperatures, ensuring longevity and durability.
  • Sputtering Efficiency: Optimized for low particle generation and uniform film thickness, enhancing the deposition process.

Industrial Applications of Platinum

Semiconductors: Platinum is essential for gate electrodes and barrier layers due to its excellent electrical properties.

Optical Coatings: Utilized for reflective coatings in optics, platinum is valued for its high reflectivity and stability.

Catalytic Converters: Platinum acts as an effective catalyst in automotive emission control systems, reducing harmful emissions.

Medical Devices: Due to its biocompatibility and durable nature, platinum is used in medical implants and equipment.

Energy Solutions: Platinum is critical in the production of electrodes for fuel cells and photovoltaic cells, enhancing energy conversion and efficiency.

Additional Services and Customization

Custom Sizing: We offer lutetium sputtering targets in diameters ranging from 1.0″ to 6.0″ and thicknesses between 0.125″ and 0.250″. If you need other dimensions, custom sizes are available upon request to meet your specific application requirements.

Target Bonding Services: Enhance your target’s handling and performance with our indium and elastomer bonding services.

Technical Support: Our experts are available to provide assistance and consultation to help you optimize your processes and achieve the best results.

Handling and Packaging

Every lutetium sputtering target is carefully handled and packaged to prevent damage and maintain high quality throughout delivery. Our packaging standards are specifically designed to protect the integrity and purity of the lutetium, ensuring it arrives in perfect condition.

Frequently Asked Questions (FAQs)

Q1: What makes lutetium ideal for sputtering targets?

A1: Lutetium’s high melting point, excellent conductivity, and resistance to oxidation make it highly effective for sputtering applications, ensuring durable and high-quality thin films.

Q2: Can the lutetium targets be customized for specific deposition systems?

A2: Yes, we can customize the size, thickness, and bonding of the lutetium targets to meet the specific needs of various deposition systems and applications.

Q3: How do you ensure the quality of your lutetium sputtering targets?

A3: Our lutetium targets are produced under strict quality control procedures, using high-purity lutetium to ensure minimal contamination and maximum performance in your processes.

Q4: What are the storage recommendations for lutetium targets?

A4: Lutetium targets should be stored in a cool, dry place and handled with care to avoid contamination. They are shipped in vacuum-sealed packaging to protect against environmental factors.

Q5: Are there recycling options for used lutetium targets?

A5: Yes, we offer a recycling program to help our clients reduce costs and support sustainability by reclaiming valuable materials from used targets.

Contact Us

For more information or to request a quote, please contact us. Our expert team is ready to assist you with your specific needs and ensure you have the best materials for your technology applications.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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