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Pneumatic Bellows Sealed SS Angle Valves (CF flanged)

Reliable and Economical Components for HV and UHV Applications

TFM provides dependable and cost-effective general-purpose components ideal for high vacuum (HV) and ultra-high vacuum (UHV) applications, emphasizing cleanliness and resistance to corrosion.

Enhanced Performance in the Open Position

In the open position, the edge-welded bellows and valve seat move out of the gas path, which effectively enhances conductance. This design feature ensures minimal resistance, optimizing gas flow and vacuum efficiency.

Temperature Resistance and Vacuum Performance

These components can endure intermittent baking temperatures up to 200°C, with a continuous operational limit of 150°C. This capability significantly improves the ultimate vacuum performance of your system.

Key Features

  • Advanced Sealing Technology: Each valve includes fluorocarbon O-ring seat seals, bellows-sealed shafts, and bonnet seals. For applications requiring higher temperature bakeout and improved ultimate vacuum, copper seals are available as an option.
  • Maintenance-Friendly Design: Normal repairs can be carried out without needing to remove the valve body from the system, ensuring quick and efficient maintenance.

Specifications for Pneumatic Models

  • Actuation Mechanisms: Pneumatic models feature a spring-to-close operation for valves 2 inches and smaller. For valves measuring 2-1/2 inches and larger, the operation is air-to-open and air-to-close.
  • Solenoid Requirement: These pneumatic valves require a solenoid for operation (sold separately; refer to accessories for details).

TFM’s bellows sealed angle valves are engineered for exceptional reliability and performance in demanding vacuum environments, making them the optimal choice for HV and UHV applications.

Specifications Table

ManufacturerTFM
PressureTorr
7.520 x 10-9 Torr
mbar
1.000 x 10-8 mbar
RatesLeak Rate
2.000 x 10-9 mbar*L/s
1.504 x 10-9 Torr*L/s
TemperatureActuator
80.0 ºC
176 ºFClosed Bake
100 ºC
212 ºFOpen Bake
100 ºC
212 ºF
Actuator
Type
Pneumatic Single Acting
Solenoid Kit
Included
No
Position
Indicators
No
Bonnet
Seal Type
Fluorocarbon (FKM)
Valve Body
Material
304L SS
Poppet
Material
Fluorocarbon (FKM)
Shaft
Seal
Welded Bellows

Ordering Table

Drawing Flange Size Bonnet Seal Type Solenoid Kit Included Position Indicators Part Number
Tooltip DN16CF (1.33" OD) Copper No No SA0075PCCF
Tooltip DN16CF (1.33" OD) Fluorocarbon (FKM) No Yes SA0075PVCF
Tooltip DN35CF-DN40CF (2.75" OD) Copper No No SA0150PCCF
Tooltip DN35CF-DN40CF (2.75" OD) Fluorocarbon (FKM) No Yes SA0150PVCF
Tooltip DN50CF (3.38" OD) Copper No No SA0200PCCF
Tooltip DN63CF (4.50" OD) Copper No No SA0250PCCF

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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