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Potassium Chloride Substrate

Potassium Chloride Substrate (KCl)

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Potassium Chloride Substrate

Potassium Chloride (KCl) is a hygroscopic crystal renowned for its use in infrared (IR) transmission applications and Fourier Transform Infrared (FTIR) spectrophotometers. This material offers excellent optical properties that are crucial in various precision industries.

Key Features

  • Hygroscopic Nature – Potassium Chloride is known for absorbing moisture from the air, which requires proper storage to maintain its properties.

  • Low Refractive Index – With its low refractive index, KCl allows for minimal light scattering, making it ideal for high-quality optical applications.

  • High Damage Threshold – The high damage threshold of KCl ensures that it can withstand intense laser beams, making it particularly valuable in laser-related applications.

  • Transparent in Infrared – KCl is transparent to infrared light, making it an essential material in the transmission of IR wavelengths.

Applications

  • Infrared Transmission – Commonly used in IR transmission systems where clarity and minimal interference are essential.

  • FTIR Spectrophotometers – Plays a key role in FTIR spectrometers, enabling high-precision chemical analysis.

  • Laser Systems – KCl is used in sputter barrier windows for CO₂ lasers due to its high damage threshold and optical transparency.

Physical Properties of Potassium Chloride Substrate

PropertySpecification
MaterialKCl
Growth MethodCrystallization Process
StructureM3
Lattice (A)a = 6.291
Melting Point770℃
Density (g/cm³)1.98 g/cm³
Wave Band0.20 – 27.50 µm
Index of Refraction1.49025
Transmission Rate0.91
Nf0.01114

Specifications of Potassium Chloride Substrate

  • Available Sizes:
    10 mm x 10 mm, 20 mm x 20 mm, 30 mm x 30 mm, Dia 50 mm
    Customized sizes are also available.
  • Thickness Options:
    2.0 mm, 3.0 mm, 5.0 mm
  • Crystal Orientation:
    <100>, <110>, <111>
  • Surface Roughness (Ra):
    < 20 nm

Packaging Information

Potassium Chloride substrates are packaged in a Class 100 clean bag or wafer container within a Class 1000 clean room to maintain purity and integrity.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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