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Potassium Tantalate Substrate (KTaO3)

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Potassium Tantalate Substrate (KTaO₃)

TFM offers high-quality Potassium Tantalate (KTaO₃) substrates, valued for their excellent dielectric properties, high permittivity, and superior crystal structure. These substrates are ideal for thin-film epitaxy, ferroelectric devices, and high-frequency applications.

KTaO₃ substrates are particularly well-suited for quantum materials, electro-optical devices, and photonic research due to their high dielectric constant and low loss tangent. Their high refractive index and transparency make them effective for use in optical coatings and photonics, especially for applications requiring precise control of light propagation. KTaO₃’s low lattice mismatch with various perovskite materials allows for high-quality epitaxial growth, making it a popular choice for ferroelectric and piezoelectric thin films, as well as high-performance capacitors and memory devices.

TFM supplies customized Potassium Tantalate substrates in various sizes and orientations to meet the demanding requirements of advanced materials research and device fabrication.

Key Physical Properties

PropertyValue
MaterialKTaO₃ (Potassium Tantalate)
StructureCubic
Growth MethodCzochralski
Hardness6.0 (Mohns)
Melting Point1352.2℃
Density7.025 g/cm³
Refractive Index2.226 @ 633 nm, 2.152 @ 1539 nm
Thermal Expansion Coefficient4.027 × 10⁻⁶/K
Transparent Wavelength380 ~ 4000 nm

Specifications

  • Size: 20×20 mm, 10×10 mm, 5×5 mm
  • Thickness: 0.5 mm
  • Polishing: SSP or DSP
  • Orientation: <100>, <110>, <111>
  • Redirection Precision: ±0.5°
  • Angle of Crystalline: Custom sizes and orientations available
  • Surface Roughness (Ra): ≤5Å (5µm × 5µm)

Packaging Details

Potassium Tantalate substrates are carefully packaged in class 100 clean bags or wafer containers within a class 1000 clean room, ensuring the highest cleanliness standards.

Choose Potassium Tantalate Substrates (KTaO₃) from TFM for superior performance in laser, optical, and semiconductor applications.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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