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ST0039 Ruthenium Sputtering Target, Ru

Chemical Formula: Ru
Catalog Number: ST0039
CAS Number: 7440-18-8
Purity: 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Ruthenium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Product Overview

Ruthenium

Ruthenium, part of the platinum group metals, is celebrated for its hardness, corrosion resistance, and exceptional catalytic properties. Our high-purity ruthenium sputtering targets are engineered for optimal performance in various thin-film deposition processes, such as Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD). These targets are essential for applications in semiconductors, display technologies, and optical devices.

Specifications

Material TypeRuthenium
SymbolRu
Color/AppearanceGray
Melting Point2334 °C
Density12370 kg/m3
Thermal Conductivity1.17 W·m-1·K-1 (25°C)
Thermal Expansion6.4 µm/(m·K) (25°C)
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Features and Applications of Ruthenium Sputtering Targets

High Melting Point and Density: Ruthenium targets are valued for their robustness and stability under extreme conditions, making them suitable for a variety of advanced applications.

Semiconductors and Electronics:

  • Utilized for thin films in memory storage devices, microchips, and advanced circuitry.

Optical Applications:

  • Employed in coatings to enhance the performance and durability of optical devices.

Chemical Industry:

  • Acts as a catalyst in chemical reactions, particularly in chlorine production and hydrogen sulfide removal.

Thin Film Deposition:

  • Ideal for Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) processes due to its high melting point and vapor pressure properties.

Customization and Services

Specialized bonding services for Ruthenium Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging and Handling

Our ruthenium sputtering targets are meticulously handled and vacuum-sealed to ensure they are delivered in optimal condition. Typical lead times range from 2 to 5 weeks. Each package includes a Material Safety Data Sheet (MSDS) and a Certificate of Analysis (COA) for your reference.

Frequently Asked Questions

Frequently Asked Questions (FAQs)

Q1: What purity levels do you offer for Ruthenium Sputtering Targets?
A1: We provide ruthenium targets with a purity of up to 99.95%.

Q2: Can Ruthenium Targets be customized in size and shape?
A2: Yes, we offer customization in various dimensions and forms to suit specific equipment and applications.

Q3: What are the bonding options available for Ruthenium Targets?
A3: We offer indium and elastomer bonding to ensure optimal performance in your specific setup.

Q4: How is Ruthenium advantageous over other metals in sputtering processes?
A4: Ruthenium offers superior hardness, corrosion resistance, and stability at high temperatures, making it ideal for demanding deposition environments.

Q5: How do you ensure the quality of your Ruthenium Targets?
A5: Each target is rigorously tested and comes with a Certificate of Analysis (COA) to ensure high standards of quality and purity are met.

Contact Us

TFM offers Ruthenium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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