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VD0573 Samarium Evaporation Materials, Sm

Material Type: Samarium
Symbol: Sm
Color/Appearance: Silvery White Metallic
Purity: 99.9% ~ 99.99%
Shape: Powder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity samarium evaporation materials, as well as a broad range of other evaporation materials. We provide these materials in both powder and granule forms and offer customized solutions to meet specific needs upon request.

MSDS File

Samarium Evaporation Material Description

Samarium is a silver-white metal with moderate hardness. Common samarium(II) compounds include SmO (samarium oxide), SmS (samarium sulfide), SmSe (samarium selenide), and SmTe (samarium telluride).

High-purity samarium evaporation materials are crucial for achieving high-quality deposited films in various deposition processes. TFM specializes in producing these materials with purities up to 99.99%, ensuring product reliability through stringent quality assurance practices.

samarium evaporation materials

Samarium Evaporation Material Specification

Material TypeSamarium
SymbolSm
Color/AppearanceSilvery
Melting Point1072°C
Density7353 kg/m3
Thermal Conductivity0.133 W·m-1·K-1 (25°C)
Electrical Resistivity88.0 nΩ·m (20 °C)
SynonymsSm Pellets, Sm Pieces, Sm Evaporation Pellet, Samarium Pellets, Samarium Pieces, Samarium Evaporation Pellet

Samarium Evaporation Material Application

– Employed in deposition processes like semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
– Used in optics for applications such as enhancing wear protection and creating decorative coatings.

Samarium Evaporation Material Packaging

We handle our samarium evaporation materials with great care to avoid any damage during storage and transportation. This meticulous approach ensures that the quality of our products is preserved in their original condition.

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TFM offers samarium evaporation materials in a range of forms, purities, sizes, and price points. We specialize in high-purity e-beam evaporation materials, engineered for maximum density and minimal average grain sizes. For the latest pricing on evaporation pellets and other deposition materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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