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ST1002 Samarium Nickel Oxide Sputtering Target, SmNiO3

Chemical FormulaSmNiO3
Catalog No.ST1002
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Drawing upon our deep materials science knowledge, TFM presents Samarium Nickel Oxide Sputtering Targets characterized by exceptional purity. Our commitment involves delivering custom solutions and competitive pricing to meet the exacting requirements of applications in nanotechnology and thin-film deposition.

MSDS File

Samarium Nickel Oxide Sputtering Target Description

We proudly introduce Samarium Nickel Oxide Sputtering Targets, distinguished by their remarkable purity and unique material composition. This exceptional purity ensures the targets’ efficacy in precise thin-film deposition processes, playing a vital role in the creation of high-quality electronic devices. The distinctive magnetic and electronic characteristics inherent in Samarium Nickel Oxide make these targets invaluable in applications ranging from electronics to magnetics and sensor technologies. Our commitment to excellence is underscored by the provision of these targets, contributing significantly to advancements in materials engineering and deposition technologies. The exceptional properties of Samarium Nickel Oxide Sputtering Targets position them at the forefront of cutting-edge technological innovations.

Related Product: Samarium Sputtering Target, Samarium Oxide Sputtering Target

Samarium Nickel Oxide Sputtering Target Specifications

Compound FormulaSmNiO3
Molecular Weight257.05
AppearanceBlack Target
Density7.79 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Samarium Nickel Oxide Sputtering Target Handling Notes

Indium bonding is recommended for the Samarium Nickel Oxide Sputtering Target due to its characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material’s low thermal conductivity and susceptibility to thermal shock make it necessary to use indium bonding to ensure optimal performance during sputtering.

Samarium Nickel Oxide Sputtering Target Application

  • Electronics: Samarium Nickel Oxide Sputtering Targets are integral to electronics manufacturing, contributing to the creation of high-performance electronic devices with their unique electronic properties.
  • Magnetics: The targets are crucial in magnetics, where their distinctive magnetic characteristics play a pivotal role in developing precise and efficient magnetic components.
  • Sensor Technologies: Samarium Nickel Oxide is valuable in sensor technologies, showcasing its versatility and adaptability in creating advanced sensors with enhanced functionalities.
  • Thin-Film Deposition: These targets are instrumental in thin-film deposition processes, ensuring precise and uniform coatings essential for various industrial and research applications.
  • Materials Engineering Advancements: SAM provides these targets with a commitment to excellence, contributing significantly to advancements in materials engineering and deposition technologies.

Samarium Nickel Oxide Sputtering Target Packaging

Our Samarium Nickel Oxide Sputtering Target is meticulously handled during storage and transportation to maintain the quality of the product in its original condition.

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TFM’s Samarium Nickel Oxide Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest average grain sizes for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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