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VD0722 Samarium(III) Oxide Evaporation Materials, Sm2O3

Catalog No.VD0722
MaterialSamarium Oxide (Sm2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in high-purity samarium(III) oxide for evaporation applications. We provide these materials in both powder and granule forms, with customization options available to suit your specific needs. Trust TFM for reliable and precise evaporation materials for your projects.

MSDS File

Samarium(III) Oxide Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) provides high-purity samarium(III) oxide evaporation materials, known by the chemical formula Sm₂O₃. Our materials are crucial for ensuring the high quality of deposited films in various processes. TFM produces these materials with a purity of up to 99.9995%, backed by strict quality assurance protocols.

Product Details

Material TypeSamarium(III) oxide
SymbolSm2O3
Color/AppearanceYellow white solid
Melting Point2,335 °C
Theoretical Density 8.347 g/cm3
Purity99.9% ~ 99.99%
ShapePowder/ Pellets/ Granule/ Custom-made

Applications

Samarium(III) oxide evaporation materials from TFM are utilized in:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Ideal for wear protection, decorative coatings, and displays.

Packaging and Handling

Our samarium(III) oxide materials are meticulously tagged and labeled to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Contact Us

For high-purity samarium(III) oxide in various forms—such as tablets, granules, rods, and wires—or for custom options, reach out to Thin-Film Mat Engineering (TFM). We also offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. Contact us for current pricing and information on other materials not listed.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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