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Sapphire Wafer

Sapphire Wafer (Al2O3)

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Sapphire Wafer (Al2O3)

Sapphire Wafer (Al2O3) is a highly versatile substrate, widely recognized for its exceptional mechanical strength, high thermal conductivity, and electrical insulation properties. These wafers are integral to various applications, including semiconductor devices, optoelectronic components, and LED technology. With superior purity and a hexagonal crystal structure, Sapphire wafers ensure outstanding performance in high-performance electronic and optical applications.

Physical Properties

  • Material: Al2O3 (Aluminum Oxide)
  • Crystal Structure: Hexagonal
  • Lattice Constants: a = 4.758 Å, c = 12.992 Å
  • Crystal Purity: >99.99%
  • Density: 3.98 g/cm³
  • Melting Point: 2040°C
  • Hardness: 9.0 on the Mohs scale
  • Thermal Expansion: 7.5 × 10⁻⁶/°C
  • Thermal Conductivity: 46.06 W/(m·K) at 0°C, 25.12 W/(m·K) at 100°C, 12.56 W/(m·K) at 400°C
  • Dielectric Constants: 9.4 at 300K (A axis), 11.58 at 300K (C axis)
  • Loss Tangent at 10 GHz: < 2 × 10⁻⁵ at A axis, < 5 × 10⁻⁵ at C axis

Specifications

  • Size Options: 10×3, 10×5, 10×10, 15×15, 20×15, 20×20, Dia 15, Dia 20, Dia 1”
  • Thickness: 0.5 mm, 1.0 mm
  • Polished: SSP or DSP
  • Crystallographic D Spacing:
    • (1120) – a plane: 2.379 Å
    • (1102) – r plane: 1.740 Å
    • (1010) – m plane: 1.375 Å
    • (1123) – n plane: 1.147 Å
    • (0001) – c plane: 2.165 Å
    • (1011) – s plane: 1.961 Å
  • Redirection Precision: ±0.5°
  • Redirection the Edge: 2° (special in 1° available)
  • Angle of Crystalline: Custom sizes and orientations available upon request
  • Surface Roughness (Ra): ≤5Å (5µm × 5µm)

Packaging

Sapphire Wafers are packaged in class 100 clean bags or wafer containers within a class 1000 clean room environment to ensure pristine conditions during handling and transport.

Ideal for high-tech industries such as optoelectronics, semiconductors, and LED production, Sapphire Wafer (Al2O3) substrates provide a reliable solution for demanding applications.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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