Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
scandium-oxide-sputtering-target-sc2o3-removebg-preview-1

ST0184 Scandium Oxide Sputtering Target, Sc2O3

Chemical Formula: Sc2O3
Catalog Number: ST0184
CAS Number: 12060-08-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Scandium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Scandium Oxide Sputtering Target Description

Scandium oxide sputtering target from TFM is an oxide sputtering material containing scandium (Sc) and oxygen (O).

ScandiumScandium is a chemical element named after Scandinavia (Latin: Scandia). It was first identified in 1879 by the chemist F. Nilson, who also successfully isolated the element. The chemical symbol for scandium is “Sc,” and it has an atomic number of 21. Located in Period 4 and Group 3 of the periodic table, scandium is part of the d-block. Its relative atomic mass is 44.955912(6) Dalton, with the number in brackets representing the uncertainty in the measurement.

Related Product: Scandium Sputtering Target

OxygenOxygen is a chemical element named from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first identified in 1771 by the chemist W. Scheele, who also successfully isolated it. The chemical symbol for oxygen is “O,” and it has an atomic number of 8. Located in Period 2 and Group 16 of the periodic table, oxygen belongs to the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets representing the uncertainty in the measurement.

Scandium Oxide Sputtering Target Specifications

Compound FormulaSc2O3
Molecular Weight137.91
AppearanceWhite
Melting Point2,485° C
Density3860 kg/m-3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Scandium Oxide Sputtering Target Packaging

Our scandium oxide sputtering targets are carefully tagged and labeled externally to ensure accurate identification and maintain stringent quality control. Special attention is given to handling these targets to prevent any potential damage during storage or transportation, thereby preserving their quality and integrity.

Get Contact

TFM offers Scandium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0184 Scandium Oxide Sputtering Target, Sc2O3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top