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ST0041 Scandium Sputtering Target, Sc Target

Chemical Formula: Sc
Catalog Number: ST0041
CAS Number: 7440-20-2
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Scandium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Scandium Sputtering Target

The Scandium Sputtering Target is a high-purity metallic material widely used in thin film deposition technologies such as PVD (Physical Vapor Deposition) and magnetron sputtering. As a rare and lightweight transition metal, scandium exhibits excellent corrosion resistance, low density, and high melting point, making it ideal for advanced applications in semiconductors, optics, and high-strength alloys.

Detailed Description

Scandium (Sc) is a silvery-white, soft metal with outstanding chemical stability and a melting point of 1541 °C. It forms uniform, adherent films that are useful for both functional and structural coatings. Scandium sputtering targets are typically produced by vacuum melting or hot-press sintering to achieve high density and purity, ensuring excellent film quality and repeatable deposition rates.

Key Features:

  • High purity (up to 99.99%) minimizes contamination and improves electrical and optical properties.

  • Excellent uniformity for consistent film deposition.

  • High thermal and chemical stability enables use in demanding process environments.

  • Customizable shapes and bonding options for different sputtering systems.

Applications

Scandium sputtering targets are used in:

  • Semiconductor thin films – for developing advanced device layers and interconnects.

  • Optoelectronic coatings – transparent conductive and anti-reflective films.

  • Alloy deposition – improving mechanical strength and corrosion resistance of aluminum and other alloys.

  • Solid-state lighting – in LED and phosphor thin film production.

  • Aerospace and energy industries – as part of Sc–Al alloys and coating systems for lightweight components.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99% (3N–4N)High purity ensures consistent film properties
Density≥ 99% theoreticalReduces voids and improves sputtering efficiency
Diameter25 – 200 mm (custom)Fits most sputtering systems
Thickness3 – 6 mmBalances lifetime and sputtering uniformity
Backing PlateCopper / TitaniumImproves heat transfer and bonding strength

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Scandium (Sc)Enhances optical & electrical film performanceSemiconductor & LED
Yttrium (Y)High transparency & hardnessOptical coatings
Aluminum (Al)Cost-effective, lightweightConductive coatings
Scandium Oxide (Sc₂O₃)High ionic conductivitySOFC & optical films

FAQ

QuestionAnswer
Can Scandium targets be customized?Yes, size, purity, and bonding can be customized.
What purity levels are available?Typically 3N (99.9%) and 4N (99.99%).
What bonding materials are used?Copper or titanium plates for thermal management.
How is it packaged?Vacuum-sealed with foam and export-safe cartons or wooden crates.
Which industries use it most?Semiconductors, LEDs, optics, aerospace, and R&D.

Packaging

Each Scandium Sputtering Target is precisely labeled and vacuum-sealed in cleanroom conditions to prevent oxidation and contamination. Foam padding and sturdy cartons or wooden crates ensure damage-free transport.

Conclusion

Scandium sputtering targets deliver exceptional performance for high-end thin film deposition, offering purity, stability, and customization. Their unique properties make them essential in advanced electronics, optics, and aerospace coating technologies.

For detailed specifications and pricing, please contact us at [sales@thinfilmmaterials.com].

Order Now

Sc 3N ø50.8*3.18mm, Sc 3N ø50.8*3mm, Sc Sc≥3N ø50.8*6.35mm (ø2” × 1/4”), Indium Bonded to Titanium B/Plate 3mm thick with keeper, Sc Sc≥3N ø50.8*3mm (ø2” × 1/4”), Indium Bonded to Titanium B/Plate 3mm thick with keeper, Sc Disc 3N ø20*10mm, Sc Rod 3N ø10*10mm, Scandium Target 4N ø152.4*3mm, Sc target 3N5 ø50.8×3mm, Sc target 3N5 ø50.8×5mm, Sc target 4N ø2"×6.35mm, Sc target 3N ø50.8×3.18 mm, Sc rod 3N5 ø3.2×200 mm, Sc rod 3N5 ø3.2×250 mm, Sc rod 4N ø6.35×50 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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