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Selenium Sputtering Target, Se

Chemical Formula: Se
Catalog Number: TFM-SPT-0523
CAS Number: 7782-49-2

Elemental Se source for sputtered thin films. Specify the purity basis, finished target dimensions, cathode and backing requirements, intended power mode, and film acceptance checks. Purity, geometry, assembly, packaging and documentation require quotation and approved specification.

CoA_Se_TRG

What is a selenium sputtering target?

A selenium sputtering target is an elemental Se source used to deposit selenium-containing films by sputtering, either as a direct layer or as one source in compound and co-sputtered film development. The RFQ should define the purity basis, target geometry, cathode and backing requirements, intended power mode, and film acceptance measurements. Target composition identifies the source material, but the deposited film must be verified under the intended process.

Use the Sputtering Targets catalog when the source material or target format is still being selected.


Selenium Sputtering Target, Se with Backing Plate, Made by TFM
Selenium Sputtering Target, Se with Backing Plate, Made by TFM

Material and Deposition Characteristics

The preferred power mode depends on the target’s electrical resistivity and the deposition system. Some elemental targets in this family can be processed with DC or pulsed-DC sputtering, while others may require RF sputtering or more conservative operating conditions. When the deposited film acts as a precursor layer for a compound or multilayer system, film analysis is recommended to verify the final composition and structure.

Selenium sputtering target selection data

Selection fieldWhat to specifyWhy it matters
Material identityElemental selenium (Se) and the required purity basisDefines the source material and the contamination limits to review
Target geometryShape, finished dimensions, tolerances, quantity, and drawing revisionConnects the material requirement to the actual cathode interface
Power and process contextIntended RF, DC, pulsed-DC, or other mode plus operating constraintsPower compatibility must be confirmed for the target and equipment combination
Backing and bondingCathode model, backing material and dimensions, interface request, cooling, and operating contextAllows mechanical support and thermal-path requirements to be reviewed together
Film acceptanceRequired composition, contamination, thickness, optical, electrical, structural, or phase measurementsCompound or composition-sensitive films require process-specific verification
Inspection and documentsList dimensional, composition, visual, packaging, or lot-document evidence requiredKeeps order acceptance criteria separate from generic catalog statements

Typical Thin-Film Applications

  • Elemental selenium films and precursor-layer development
  • Chalcogenide, optical, electronic, infrared, thermoelectric, or phase-change studies where the approved design specifies selenium
  • Co-sputtering or subsequent compound-formation projects with defined composition and phase measurements

Application fit depends on the complete layer design and qualified deposition process. Review the broader thin-film application categories before finalizing the target RFQ.

Target Configuration and Ordering Considerations

For a selenium target quotation, provide the purity basis, target shape and finished dimensions, drawing revision, quantity, cathode model, backing and interface requirements, intended power mode, cooling and operating context, plus any tolerance, packaging, inspection, or lot-document requirements. Send the available drawing and acceptance criteria to TFM for review; unlisted dimensions, bonding, purity, packaging, and documentation requirements remain subject to quotation and approved specification.

Frequently Asked Questions

What is a Selenium sputtering target typically used for?

It is used either to deposit the elemental film directly or to serve as a source component in compound, optical, electronic, chalcogenide, or other functional thin-film systems.

Should Selenium be sputtered with DC or RF power?

The best power mode depends on target resistivity, dimensions, and sputtering-system capability. Some elemental targets in this family can work with DC or pulsed-DC power, while others are more commonly evaluated with RF power.

Why is purity important for a Selenium target?

Many of these materials are used in composition-sensitive thin films, so metallic or chemical impurities can affect the behavior of the final film or multilayer stack. The target purity should therefore be matched to the application.

Can a Selenium target be ordered as a bonded assembly?

A bonded assembly request should include the cathode model or drawing, target dimensions, backing material and dimensions, interface requirement, cooling, and operating context. Availability and the final assembly specification must be confirmed in the quotation.

Does target composition guarantee film composition for Selenium?

Not always. Film composition can shift because of sputtering conditions, substrate temperature, chamber history, and re-sputtering effects. Film analysis is recommended when the final composition is critical.

What should be included in an RFQ for Selenium?

Provide purity, dimensions, quantity, target configuration, backing requirement if any, cathode model or drawing, and any special packaging or inspection-document requirements.

Prepare your RFQ: Download the fillable Selenium Sputtering Target, Se RFQ Worksheet (PDF). Enter the required composition or grade, dimensions, backing or bonding request, quantity, documents, and acceptance criteria for quotation review.

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Ø1" × 3.18 mm, Selenium (Se), 4N, Ø2" × 3 mm + 3 mm Ti Backing Plate, Selenium (Se), 4N, Ø2" × 3.18 mm, Selenium (Se), 4N, Ø2" × 6.35 mm + 3 mm Ti Backing Plate, Selenium (Se), 4N

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

Manufacturing routes depend on the material and target specification. Metal targets may be cast and machined, while some ceramic targets are consolidated by sintering. Ask for the product-specific route and inspection criteria when these affect qualification.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Bonding may be selected for brittle targets, thinner precious-metal targets, or a cathode that needs a specific backing and cooling arrangement. It is not a universal requirement. Provide target and backing dimensions, the cathode model, and operating conditions for assembly review.

 

DC is commonly used with conductive targets. RF is often used for poorly conducting or insulating targets to mitigate surface charging; other power modes may be suitable depending on the target, cathode, and process. Confirm the mode against the equipment and material.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Customer-supplied powder acceptance is not assumed. Provide material identity, lot traceability, composition and impurity analysis, quantity, and handling constraints in the RFQ. TFM must confirm feasibility and acceptance criteria before any material is sent.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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