Product Overview
Silicon Chromium Sputtering Target (Si/Cr) is an alloy sputtering target used to deposit composition-controlled alloy films. Relative to a pure elemental target, the alloying constituents are introduced to tune electrical, magnetic, optical, mechanical, or adhesion-related film properties. For this reason, alloy ratio, homogeneity, purity basis, and the intended film composition should be defined clearly in the procurement specification.
Material and Deposition Characteristics
Many alloy targets are electrically conductive and can be compatible with DC or pulsed-DC magnetron sputtering, subject to the actual alloy composition and equipment capability. The target composition is not always reproduced exactly in the deposited film because preferential sputtering, re-sputtering, substrate heating, and process gas conditions can shift the final ratio. For composition-sensitive work, deposited-film analysis should be part of process qualification.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Purity | 99.9% – 99.99% metals | Higher purity improves film quality and device reliability |
| Composition | Custom Si/Cr ratios | Allows tuning of electrical and mechanical properties |
| Density | ≥99% theoretical | Ensures stable sputtering and uniform deposition |
| Diameter | 25 – 300 mm (custom) | Compatible with various sputtering cathodes |
| Thickness | 3 – 6 mm | Influences sputtering rate and target lifetime |
| Bonding | Copper backing plate (optional) | Improves heat transfer and structural stability |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Silicon Chromium (Si/Cr) | Balanced electrical stability and corrosion resistance | Semiconductor thin films and protective coatings |
| Chromium (Cr) | Excellent adhesion and corrosion resistance | Protective coatings and adhesion layers |
| Silicon (Si) | Semiconductor properties | Electronic devices and microelectronics |
| Question | Answer |
|---|---|
| Can Si/Cr sputtering targets be customized? | Yes, the silicon-to-chromium ratio, dimensions, and bonding options can be customized according to deposition requirements. |
| Which sputtering method is recommended for Si/Cr targets? | DC magnetron sputtering is commonly used when the alloy is conductive, while RF sputtering may be used for certain compositions. |
| Are bonded targets available? | Yes, Si/Cr targets can be indium-bonded or elastomer-bonded to copper backing plates for improved thermal management. |
| What substrates are compatible with Si/Cr thin films? | Silicon wafers, glass, ceramics, and metal substrates are commonly used depending on the application. |
| Which industries commonly use Si/Cr sputtering targets? | Semiconductor manufacturing, microelectronics production, protective coating industries, and advanced materials research laboratories. |
Typical Thin-Film Applications
- Silicon Chromium alloy films where composition control is important to electrical, mechanical, magnetic, or optical performance
- Multilayer stacks, adhesion/barrier layers, conductive films, or functional coatings depending on the alloy system
- Research and production programs that require customized alloy ratios and repeatable sputtering behavior
Target Configuration and Ordering Considerations
For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.
Frequently Asked Questions
Can the composition of a Silicon Chromium sputtering target be customized?
Yes. For alloy targets, the required ratio should be specified clearly in wt% or at%. TFM can review custom compositions together with purity, dimensions, and manufacturability.
Will an alloy target always produce a film with the same composition?
Not necessarily. Preferential sputtering, substrate heating, process gas, and re-sputtering effects can shift the deposited composition relative to the nominal target chemistry. Film analysis should be used when the composition is critical.
Is a Silicon Chromium alloy target compatible with DC magnetron sputtering?
Many metallic alloy targets are electrically conductive and can be compatible with DC or pulsed-DC sputtering, but the final choice depends on the actual alloy system and equipment.
Why is alloy homogeneity important in a Silicon Chromium target?
A uniform alloy distribution helps support stable erosion and reduces local composition variation across the target, which in turn helps improve run-to-run consistency.
Can a Silicon Chromium target be supplied bonded?
Yes. Where the cathode or thermal load requires it, TFM can supply bonded assemblies. Backing-plate material, target thickness, bonding method, and operating power should be reviewed together.
What should I include in an RFQ for Silicon Chromium?
Specify the alloy composition, purity basis, dimensions, quantity, backing requirement, cathode model or drawing, and any tolerance, inspection, or documentation requirements.
Reviews
There are no reviews yet.