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ST0905 Silver Copper Sputtering Targets, Ag/Cu

Chemical FormulaAg/Cu
Catalog No.ST0905
CAS Number12249-45-5
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Silver Copper sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Silver Copper Sputtering Targets Description

Silver Copper Sputtering Target is engineered for use in sputter deposition, a method employed to apply thin films onto substrates across multiple industries, including electronics, optics, and solar cells. This process involves bombarding the target with high-energy ions, which ejects atoms or molecules from the target material. These ejected particles then deposit onto a substrate, forming a thin film.

Related Product: Silver Sputtering Target, Copper Sputtering Target

Silver Copper Sputtering Targets Specifications

Compound FormulaAg/Cu
Molecular Weight171.41
Appearance         Yellowish to silvery metallic solid
Melting Point779-900℃
Density9.7-10.4 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Silver Copper Sputtering Targets Application

Silver Copper Sputtering Target enables the deposition of thin films with customized electrical and conductive properties. It is particularly useful in creating conductive layers for electronic devices, including semiconductors, sensors, and thin-film solar cells.

Silver Copper Sputtering Targets Packaging

Our Silver Copper Sputtering Targets are meticulously managed during storage and transportation to ensure that they retain their quality and remain in optimal condition.

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TFM offers Silver Copper Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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