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VD0579 Silver Evaporation Materials, Ag

Material Type: Silver
Symbol: Ag
Color/Appearance: Silver, Metallic
Purity: 99.99%
Shape: Powder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity silver evaporation materials, along with a broad selection of other evaporation materials. We provide these materials in both powder and granule forms, and we also offer customized options to meet specific requirements upon request.

MSDS File

Silver Evaporation Materials Description

Silver, with a melting point of 962°C, a density of 10.5 g/cc, and a vapor pressure of 10^-4 Torr at 1,105°C, has been utilized in numerous applications since ancient times. Known for its ductility, malleability, and being the most electrically conductive metal, silver is considered a precious metal. It is commonly used in jewelry, solders, paints, and mirrors.

In deposition processes, high-purity evaporation materials are crucial for achieving high-quality deposited films. TFM specializes in producing silver evaporation materials with purity levels up to 99.99%. Our rigorous quality assurance procedures ensure that our products meet the highest standards of reliability and performance.

silver evaporation materials

Silver Evaporation Materials Specification

Material TypeSilver
SymbolAg
Atomic Number47
Color/AppearanceSilver, Metallic
Melting Point962 °C
Theoretical Density10.5 g/cc
SynonymsSilver Pellets, Silver Pieces, Silver Evaporation Pellet, Ag Pellets, Ag Pieces, Ag Evaporation Pellet

Silver Evaporation Materials Applications

  • Deposition Processes: Silver evaporation materials are employed in various deposition techniques such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: They are also used in optics for applications like wear protection, decorative coatings, and display technologies.

Silver Evaporation Materials Packaging

We take great care in handling our silver evaporation materials to avoid damage during storage and transportation, ensuring that their quality remains intact in their original condition.

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TFM offers silver evaporation materials in a range of forms, purities, sizes, and price points. We excel in producing high-purity e-beam evaporation materials, focusing on achieving the highest density and smallest average grain sizes. For current pricing on evaporation pellets and other deposition materials not listed, please contact us for more information.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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