Silver-Plated Annealed OFHC Copper Gaskets for ConFlat (CF) UHV Flanges

Silver-Plated Annealed OFHC Copper Gaskets for ConFlat (CF) UHV Flanges

TFM’s Silver-Plated Annealed OFHC Copper Gaskets for ConFlat (CF) UHV Flanges are designed for ultra-high vacuum (UHV) environments that demand both superior vacuum sealing and enhanced chemical resistance. These gaskets combine the softness and high purity of oxygen-free high-conductivity (OFHC) copper with the corrosion-resistant benefits of silver plating, making them ideal for demanding vacuum and cryogenic applications.

Key Features

• Silver Plating for Enhanced Corrosion Resistance
  A uniform silver coating over the copper gasket provides a chemically inert surface that resists oxidation, sulfurization, and aggressive process gases. This increases the gasket’s lifespan and maintains its sealing integrity in reactive or moist environments.

• High-Purity Annealed OFHC Copper Core
  The base of the gasket is made from annealed OFHC copper, known for its exceptional thermal and electrical conductivity. The annealing process ensures the copper remains soft enough to conform tightly to flange surfaces, ensuring a vacuum-tight seal.

• Optimized for UHV Systems
  These gaskets are precisely engineered to fit ConFlat (CF) UHV flanges, providing a consistent and reliable seal in systems operating at pressures as low as 10⁻¹¹ Torr.

• Superior Thermal and Electrical Conductivity
  The combination of OFHC copper and silver allows for excellent heat and current transfer across flange interfaces, making these gaskets ideal for systems where thermal management is critical.

• Non-Magnetic and Vacuum-Compatible
  The materials used are non-magnetic and ultra-clean, supporting sensitive scientific instruments and processes that require minimal magnetic interference and outgassing.

Applications

• High-Purity and Reactive Gas Environments
  Common in systems utilizing corrosive gases, including hydrogen, halogens, or ammonia. The silver plating minimizes chemical reaction on the gasket surface.

• Cryogenics and Superconducting Systems
  Excellent for cryogenic applications due to superior thermal conductivity and compatibility with ultra-low temperatures.

• Synchrotron Radiation and Particle Accelerators
  Widely used in beamline sealing, where vacuum integrity and minimal contamination are critical.

• UHV Surface Science and Analytical Equipment
  Suitable for XPS, SEM, TEM, and other high-vacuum analytical instruments.

• Thin Film Deposition and Etching Systems
  Supports clean operation in sputtering, evaporation, and etching environments where gas purity and system vacuum are essential.

Specifications

• Material Core: Annealed Oxygen-Free High Conductivity (OFHC) Copper

• Plating: Uniform Silver (typically 5–10 µm thickness)

• Compatibility: ConFlat (CF) flanges

• Vacuum Rating: Suitable for UHV systems down to 10⁻¹¹ Torr

• Temperature Range: Up to 450°C in vacuum

• Conductivity: High thermal and electrical conductivity

• Chemical Resistance: Excellent due to silver surface

• Reusability: Single-use gasket; reusable flanges

Advantages Over Standard Copper Gaskets

• Reduced tendency to bond or seize to knife edges during use

• Improved resistance to tarnishing and corrosion in reactive atmospheres

• Lower risk of particulate contamination due to smoother surface

• Better performance in environments exposed to water vapor or trace acids

Why Choose TFM?

At TFM, we deliver precision-engineered UHV sealing solutions tailored to meet the exacting needs of advanced scientific, industrial, and research-grade vacuum systems. Our Silver-Plated Annealed OFHC Copper Gaskets for ConFlat (CF) UHV Flanges provide a unique blend of vacuum reliability, corrosion resistance, and superior conductivity—trusted by professionals in the semiconductor, cryogenics, and high-energy physics sectors worldwide.