Silver-Plated OFHC Copper Gaskets for ConFlat (CF) UHV Flanges
Silver-Plated OFHC Copper Gaskets for ConFlat (CF) UHV Flanges, manufactured by TFM, are engineered to provide high-performance sealing solutions in ultra-high vacuum (UHV) systems. These gaskets offer superior conductivity, corrosion resistance, and long-lasting vacuum sealing capabilities, making them ideal for demanding environments, such as UHV research, semiconductor processing, and cryogenics.
Key Features
High-Purity OFHC Copper Core
Constructed from oxygen-free high-conductivity copper (OFHC), these gaskets are guaranteed to have over 99.99% purity, ensuring minimal outgassing and excellent thermal conductivity for reliable performance in UHV applications.Silver Plating for Enhanced Conductivity and Corrosion Resistance
The silver plating provides superior electrical conductivity and protection against oxidation and corrosion, which is especially valuable in applications involving reactive gases and extreme vacuum conditions.Reliable UHV Sealing
Designed to form a tight metal-to-metal seal with ConFlat (CF) flange knife edges, these gaskets ensure leak-tight performance in vacuum chambers with pressures down to 10⁻¹¹ Torr.Excellent for High-Temperature and Cryogenic Applications
These gaskets maintain integrity and functionality even during high-temperature bake-outs or in cryogenic environments, making them versatile for a wide range of applications.Cost-Effective Solution
Silver plating offers a cost-effective balance of performance and durability compared to other precious metals, providing reliable sealing without the high cost of gold.
Applications
UHV Research and Scientific Instruments
Ideal for UHV applications in research laboratories, including spectroscopy, electron microscopy, and surface science, where a clean, reliable seal is essential.Semiconductor Manufacturing
Perfect for use in semiconductor processing systems such as sputtering, ALD, and PVD, where high-purity vacuum conditions are critical for the production of advanced materials and devices.Cryogenic and Superconducting Systems
These gaskets are suitable for cryogenic applications, such as low-temperature physics experiments and superconducting systems, due to their excellent sealing capabilities and durability in extreme temperatures.Gas Handling and Process Systems
Used in industrial applications that require high-vacuum conditions, including those handling reactive or corrosive gases, ensuring long-term sealing without degradation.
Technical Specifications
Material: OFHC Copper (annealed)
Plating: Silver (electroplated)
Purity: Copper >99.99%
Vacuum Rating: Down to 10⁻¹¹ Torr
Temperature Tolerance: Up to 450°C
Flange Compatibility: ConFlat (CF) UHV flanges
Surface Finish: Smooth, burr-free for optimal sealing
Usage: Single-use for maximum sealing integrity
Benefits of Silver-Plated OFHC Copper Gaskets
Enhanced Conductivity: The silver plating increases the thermal and electrical conductivity of the gasket, improving heat dissipation and performance in vacuum applications.
Corrosion Resistance: The silver coating protects the copper from oxidation and other corrosive effects, extending the lifespan of the gasket.
Superior Vacuum Sealing: Offers leak-tight sealing in UHV systems with excellent compression characteristics.
Durable in Harsh Environments: The gaskets are suitable for high-temperature bake-outs and extreme vacuum conditions, ensuring consistent performance over time.
Cost-Effective: While offering enhanced performance, silver-plated gaskets are more affordable than their gold-plated counterparts.
Why Choose TFM?
TFM’s Silver-Plated OFHC Copper Gaskets for ConFlat (CF) UHV Flanges are precision-manufactured for ultimate vacuum integrity and durability. These gaskets are an essential component for ensuring clean, reliable seals in high-performance vacuum systems, making them a trusted choice for UHV research, semiconductor manufacturing, and cryogenic systems.
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