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VD0579C Silver Sulfide Pellet Evaporation Material (Ag2S)

MSDS File
Material TypeSilver Sulfide
SymbolAg2S
Color/AppearanceGrayish-black crystal
Melting Point (°C)836
Theoretical Density (g/cc)7.234
Z Ratio–
E-Beam–
Thermal Evaporation TechniquesBoat:  –
Crucible:  –
E-Beam Crucible Liner Material–
Temp. (°C) for Given Vap. Press. (Torr)–
Comments–

Silver Sulfide Pellet Evaporation Material

TFM provides high-purity Silver Sulfide Pellet Evaporation Material, designed for precision thin-film deposition in advanced semiconductor, optoelectronic, and infrared detection applications. Composed of silver (Ag) and sulfur (S), this material exhibits excellent electrical conductivity, stable optical properties, and superior thermal performance, making it ideal for next-generation device fabrication.

The evaporation process using Silver Sulfide Pellet Evaporation Material ensures the deposition of uniform, high-density films with precise thickness control. This material is optimized for vacuum deposition techniques such as thermal evaporation and electron beam (E-beam) evaporation, delivering high-quality coatings with minimal defects and excellent adhesion.

Key Features and Advantages

  • High Purity & Controlled Stoichiometry: TFM ensures stringent quality control, maintaining an optimal Ag₂S phase for superior film characteristics.

  • Excellent Electrical Properties: This material offers high carrier mobility and controlled resistivity, making it ideal for semiconductor applications.

  • Stable Optical Performance: Silver sulfide exhibits strong infrared absorption, making it valuable in IR detectors, sensors, and photodetectors.

  • Superior Thermal Stability: With high-temperature resilience, the material maintains structural integrity in extreme conditions, ensuring long-term performance.

  • Enhanced Film Uniformity: The evaporation process produces smooth, defect-free thin films with excellent adhesion to various substrates.

Applications

  • Infrared Detectors & Imaging Sensors: Its strong IR absorption properties make it essential for night vision systems, thermal cameras, and spectroscopy devices.

  • Semiconductor & Electronic Components: Used in thin-film transistors (TFTs) and integrated circuits for its electrical properties.

  • Photovoltaic & Energy Applications: Silver sulfide plays a role in solar cells and energy harvesting technologies, improving efficiency and durability.

  • Optoelectronic Devices: Used in optical switches, infrared photodetectors, and laser systems.

Industry Impact and Customization

TFM’s Silver Sulfide Pellet Evaporation Material supports innovation in thin-film technology, enabling the production of high-performance electronic and optoelectronic devices. Our manufacturing process ensures customizable material properties, such as film density and Ag:S ratios, to meet the specific needs of researchers and industrial manufacturers.

With exceptional electrical, optical, and thermal characteristics, TFM’s Silver Sulfide Pellet Evaporation Material is a vital material for advanced thin-film deposition applications, providing superior performance in infrared imaging, semiconductor devices, and energy conversion technologies.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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