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VD0579B Silver Telluride Pellet Evaporation Material (Ag2Te)

Material TypeSilver Telluride
SymbolAg2Te
Color/Appearancegrey-black crystals
Melting Point (°C)955
Theoretical Density (g/cc)8.318
Z Ratio
E-Beam
Thermal Evaporation TechniquesBoat:  –
Crucible:  –
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

 

Silver Telluride Pellet Evaporation Material

TFM offers high-quality Silver Telluride Pellet Evaporation Material, engineered for advanced thin-film deposition in semiconductor, optoelectronic, and thermoelectric applications. This material, composed of silver (Ag) and tellurium (Te), is meticulously formulated to deliver outstanding electrical conductivity, excellent optical absorption, and robust thermal stability, making it indispensable for next-generation device fabrication.

The evaporation process is carefully controlled to ensure uniform, defect-free films with precise thickness control and low impurity levels. TFM’s Silver Telluride Pellet Evaporation Material is optimized for deposition techniques such as thermal evaporation and electron beam (E-beam) evaporation, providing high reproducibility and consistent film quality.

Key Features and Advantages

  • High Purity & Precise Stoichiometry: Manufactured under stringent quality control, the material maintains an optimized Ag:Te ratio, often targeting the Ag₂Te phase to achieve superior electrical and optical performance.

  • Uniform Film Formation: The evaporation process delivers films with excellent uniformity, high density, and controlled thickness, essential for applications in integrated circuits, photodetectors, and thin-film transistors.

  • Superior Electrical and Optical Properties: With excellent carrier mobility and low resistivity, the material is ideal for high-speed electronic devices. Its strong infrared absorption and stable optical behavior are critical for infrared detectors and optical modulators.

  • Robust Thermal Stability: The material withstands high-temperature processing and harsh operational environments, ensuring long-term reliability in thermoelectric devices, solar cells, and other energy conversion systems.

  • Enhanced Deposition Efficiency: Optimized for high deposition rates, the material supports efficient vacuum deposition, resulting in high-quality thin films with excellent adhesion and low defect density.

Applications of Silver Telluride Pellet Evaporation Material

  • Infrared Detectors & Sensors: The strong infrared absorption makes it ideal for thermal imaging cameras, night vision systems, and other sensor technologies.

  • Thermoelectric Devices: Its excellent thermoelectric properties, including a high Seebeck coefficient, contribute to efficient energy conversion in cooling systems and power generation modules.

  • Photovoltaics & Solar Cells: Used as an absorber layer in thin-film solar cells, it enhances light-to-electricity conversion efficiency while maintaining stability under prolonged exposure.

  • Optoelectronic Components: Its superior electrical and optical characteristics enable its use in light-emitting diodes (LEDs), optical modulators, and laser systems.

  • Advanced Semiconductor Devices: With its consistent film quality and uniform density, it is well-suited for the fabrication of integrated circuits and high-performance thin-film transistors (TFTs).

Industry Impact and Customization

TFM’s Silver Telluride Pellet Evaporation Material is at the forefront of thin-film technology innovation. Our advanced manufacturing techniques allow for customization of deposition parameters, including precise control over the Ag:Te ratio and film density, to meet the specific demands of various high-tech applications. This customization enhances film adhesion, improves electrical performance, and ensures long-term operational stability across a range of devices.

In summary, TFM’s Silver Telluride Pellet Evaporation Material combines high purity, precise stoichiometry, and exceptional electrical, optical, and thermal properties, making it a critical component for cutting-edge thin-film deposition processes. Its reliable performance in high-tech applications—from infrared imaging and thermoelectric devices to integrated semiconductor systems—positions it as an indispensable resource for innovators in the semiconductor and optoelectronic industries.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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